Heng Chen Lee

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Seremban, MY

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Patents Grantslast 30 patents

Information Patent Grant
Methods for loading or unloading substrate with evaporator planet
- Patent number 11,114,329
- Issue date Sep 7, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicoductor wafer and method of backside probe testing through ope...
- Patent number 10,685,891
- Issue date Jun 16, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer and method of probe testing
- Patent number 10,461,000
- Issue date Oct 29, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of backside probe testing through op...
- Patent number 10,170,381
- Issue date Jan 1, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer and method of backside probe testing through op...
- Patent number 9,793,186
- Issue date Oct 17, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EVAPORATOR SUBSTRATE LOADING SYSTEMS AND RELATED METHODS
- Publication number 20200321235
- Publication date Oct 8, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICODUCTOR WAFER AND METHOD OF BACKSIDE PROBE TESTING THROUGH OPE...
- Publication number 20190096777
- Publication date Mar 28, 2019
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF PROBE TESTING
- Publication number 20180190552
- Publication date Jul 5, 2018
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BACKSIDE PROBE TESTING THROUGH OP...
- Publication number 20180040522
- Publication date Feb 8, 2018
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS