Heng-Cheng Chu

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating electronic package structure
- Patent number 11,476,572
- Issue date Oct 18, 2022
- Siliconware Precision Industries Co., Ltd.
- Chih-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure
- Patent number 10,587,037
- Issue date Mar 10, 2020
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 10,230,152
- Issue date Mar 12, 2019
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,199,731
- Issue date Feb 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 9,997,477
- Issue date Jun 12, 2018
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,627,748
- Issue date Apr 18, 2017
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,337,250
- Issue date May 10, 2016
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of carrier-free semiconductor package
- Patent number 8,962,396
- Issue date Feb 24, 2015
- Siliconware Precision Industries Co., Ltd.
- Ching-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,963,299
- Issue date Feb 24, 2015
- Siliconware Precision Industries Co., Ltd.
- Chien-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-free semiconductor package
- Patent number 8,618,655
- Issue date Dec 31, 2013
- Siliconware Precision Industries Co., Ltd.
- Ching-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with ESD and EMI preventing functions
- Patent number 8,264,070
- Issue date Sep 11, 2012
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE STRUCTURE
- Publication number 20200161756
- Publication date May 21, 2020
- Siliconware Precision Industries Co., Ltd.
- Chih-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20180090835
- Publication date Mar 29, 2018
- Siliconware Precision Industries Co., Ltd.
- Chih-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20170187117
- Publication date Jun 29, 2017
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20160225728
- Publication date Aug 4, 2016
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20150162661
- Publication date Jun 11, 2015
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150123251
- Publication date May 7, 2015
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20140210672
- Publication date Jul 31, 2014
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140210687
- Publication date Jul 31, 2014
- Silconware Precision Industries Co., Ltd.
- CHIH-HSIEN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140203395
- Publication date Jul 24, 2014
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF CARRIER-FREE SEMICONDUCTOR PACKAGE
- Publication number 20140080265
- Publication date Mar 20, 2014
- Siliconware Precision Industries Co., Ltd.
- Ching-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130320513
- Publication date Dec 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Chien-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120228769
- Publication date Sep 13, 2012
- Siliconware Precision Industries Co., Ltd.
- Ching-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120170162
- Publication date Jul 5, 2012
- Siliconware Precision Industries Co., Ltd.
- Hao-Ju Fang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGE STRUCTURE WITH ESD AND EMI PREVENTING FUNCTIONS
- Publication number 20120074538
- Publication date Mar 29, 2012
- Siliconware Precision Industries Co., Ltd.
- Tsung-Hsien Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal multi-media gateway
- Publication number 20040179540
- Publication date Sep 16, 2004
- Chang-Hung Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Heng-Cheng Chu

Person

Patents Grantslast 30 patents

Method for fabricating electronic package structure

Electronic package structure

Electronic package and fabrication method thereof

Electronic component

Method of manufacturing semiconductor package

Electronic component

Semiconductor package and method of manufacturing the same

Fabrication method of carrier-free semiconductor package

Semiconductor package and fabrication method thereof

Carrier-free semiconductor package

Package structure with ESD and EMI preventing functions

Patents Applicationslast 30 patents

METHOD FOR FABRICATING ELECTRONIC PACKAGE STRUCTURE

ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

ELECTRONIC COMPONENT

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

FABRICATION METHOD OF CARRIER-FREE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE WITH ESD AND EMI PREVENTING FUNCTIONS

Universal multi-media gateway