Heng Keong Yip

Person

Subang Jaya, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Heat spreader for center gate molding
- Patent number 8,643,172
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming stacked die package
- Patent number 7,955,953
- Issue date Jun 7, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with improved crack protection
- Patent number 7,741,196
- Issue date Jun 22, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making solder pad
- Patent number 7,566,648
- Issue date Jul 28, 2009
- Freescale Semiconductor Inc.
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array quad flat no-lead package and method of forming same
- Patent number 7,531,383
- Issue date May 12, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming reinforced interconnects on a substrate
- Patent number 7,494,924
- Issue date Feb 24, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming flip-chip bump carrier type package
- Patent number 7,473,586
- Issue date Jan 6, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stackable package
- Patent number 7,384,819
- Issue date Jun 10, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making exposed pad ball grid array package
- Patent number 7,282,395
- Issue date Oct 16, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME SHEET AND OPTOELECTRONIC SEMICONDUCTOR DEVICE
- Publication number 20240290696
- Publication date Aug 29, 2024
- ams-OSRAM International GmbH
- Choo Kean Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED DIE PACKAGE
- Publication number 20090152717
- Publication date Jun 18, 2009
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR CENTER GATE MOLDING
- Publication number 20080305584
- Publication date Dec 11, 2008
- Chee Seng Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING SOLDER PAD
- Publication number 20080258297
- Publication date Oct 23, 2008
- Heng Keong YIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD FOR SEMICONDUCTOR DEVICE
- Publication number 20080182120
- Publication date Jul 31, 2008
- Lan Chu Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH IMPROVED CRACK PROTECTION
- Publication number 20080179710
- Publication date Jul 31, 2008
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY QUAD FLAT NO-LEAD PACKAGE AND METHOD OF FORMING SAME
- Publication number 20080099784
- Publication date May 1, 2008
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A TRACE EMBEDDED PACKAGE
- Publication number 20070281393
- Publication date Dec 6, 2007
- Viswanadam Gautham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming stackable package
- Publication number 20070254409
- Publication date Nov 1, 2007
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming reinforced interconnects on a substrate
- Publication number 20070207605
- Publication date Sep 6, 2007
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making exposed pad ball grid array package
- Publication number 20070128766
- Publication date Jun 7, 2007
- Heng Keong Yip
- H01 - BASIC ELECTRIC ELEMENTS

Heng Keong Yip

Person

Patents Grantslast 30 patents

Heat spreader for center gate molding

Method of forming stacked die package

Semiconductor wafer with improved crack protection

Method of making solder pad

Array quad flat no-lead package and method of forming same

Method for forming reinforced interconnects on a substrate

Method of forming flip-chip bump carrier type package

Method of forming stackable package

Method of making exposed pad ball grid array package

Patents Applicationslast 30 patents

LEAD FRAME SHEET AND OPTOELECTRONIC SEMICONDUCTOR DEVICE

METHOD OF FORMING STACKED DIE PACKAGE

HEAT SPREADER FOR CENTER GATE MOLDING

METHOD OF MAKING SOLDER PAD

BOND PAD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER WITH IMPROVED CRACK PROTECTION

ARRAY QUAD FLAT NO-LEAD PACKAGE AND METHOD OF FORMING SAME

METHOD OF FORMING A TRACE EMBEDDED PACKAGE

Method of forming stackable package

Method for forming reinforced interconnects on a substrate

Method of making exposed pad ball grid array package