Heng-Ming Nien

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of circuit board
- Patent number 12,052,815
- Issue date Jul 30, 2024
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,859,302
- Issue date Jan 2, 2024
- Unimicron Technology Corp.
- Heng-Ming Nien
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Co-axial via structure
- Patent number 11,792,918
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Pei-Wei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,785,707
- Issue date Oct 10, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,686,008
- Issue date Jun 27, 2023
- Unimicron Technology Corp.
- Heng-Ming Nien
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240023251
- Publication date Jan 18, 2024
- Unimicron Technology Corp.
- Shao-Chien LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20230389172
- Publication date Nov 30, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20230124732
- Publication date Apr 20, 2023
- Unimicron Technology Corp.
- Heng-Ming Nien
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20230120741
- Publication date Apr 20, 2023
- Unimicron Technology Corp.
- Heng-Ming Nien
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20230124913
- Publication date Apr 20, 2023
- Unimicron Technology Corp.
- Heng-Ming Nien
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CO-AXIAL VIA STRUCTURE
- Publication number 20220240368
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Pei-Wei WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220232694
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Heng-Ming Nien

Person

Patents Grantslast 30 patents

Manufacturing method of circuit board

Electroplating apparatus and electroplating method

Co-axial via structure

Circuit board and manufacturing method thereof and electronic device

Electroplating apparatus and electroplating method

Patents Applicationslast 30 patents

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF CIRCUIT BOARD

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

CO-AXIAL VIA STRUCTURE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE