Heng-Yen Lee

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Hsin Chu Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
LED package structure and method for making the same
- Patent number 7,211,882
- Issue date May 1, 2007
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water-cooling heat dissipation device adopted for modulized LEDs
- Patent number 7,140,753
- Issue date Nov 28, 2006
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
LED packaging structure
- Patent number 7,049,639
- Issue date May 23, 2006
- Harvatek Corporation
- Bily Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal base design for surface mount device LED (light emitting diode)
- Patent number D506187
- Issue date Jun 14, 2005
- Harvatek Corporation
- Bily Wang
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
LED package structure and method making of the same
- Publication number 20060261455
- Publication date Nov 23, 2006
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED package structure and method making of the same
- Publication number 20060214273
- Publication date Sep 28, 2006
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Water-cooling heat dissipation device adopted for modulized LEDs
- Publication number 20060034085
- Publication date Feb 16, 2006
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Application
LED packaging structure
- Publication number 20050274957
- Publication date Dec 15, 2005
- Harvatek Corporation
- Bily Wang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...