Heng Yu Kung

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Linyuan Hsiang, TW

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Patents Grantslast 30 patents

Information Patent Grant
Device for attaching a semiconductor device to a circuit board
- Patent number 10,605,828
- Issue date Mar 31, 2020
- Advanced Semiconductor Engineering, Inc.
- Heng Yu Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test assembly for integrated circuit package
- Patent number 6,788,092
- Issue date Sep 7, 2004
- Advanced Semiconductor Engineering, Inc.
- Po Jen Cheng
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DEVICE FOR ATTACHING A SEMICONDUCTOR DEVICE TO A CIRCUIT BOARD
- Publication number 20180284152
- Publication date Oct 4, 2018
- Advanced Semiconductor Engineering, Inc.
- Heng Yu KUNG
- G01 - MEASURING TESTING
Information Patent Application
Test assembly for integrated circuit package
- Publication number 20040155241
- Publication date Aug 12, 2004
- Advanced Semiconductor Engineering, Inc.
- Po Jen Cheng
- G01 - MEASURING TESTING
Information Patent Application
Test assembly for integrated circuit package
- Publication number 20030193344
- Publication date Oct 16, 2003
- Advanced Semiconductor Engineering, Inc.
- Po Jen Cheng
- G01 - MEASURING TESTING