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Hengkang Wu

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  • Dongguan, CN
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Patents Applicationslast 30 patents

  • Information Patent Application

    Grounding Member and Manufacturing Method of it, Grounding Assembly...
    • Publication number 20240429659
    • Publication date Dec 26, 2024
    • Tyco Electronics Holdings (Bermuda) No. 7 Limited
    • Hengkang Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Connector and Device Comprising the Same
    • Publication number 20240396266
    • Publication date Nov 28, 2024
    • Tyco Electronics Holdings (Bermuda) No. 7 Limited
    • Hengkang Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Connector and Device Comprising the Same
    • Publication number 20240364055
    • Publication date Oct 31, 2024
    • Tyco Electronics (Shanghai) Co., Ltd.
    • Hengkang Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Connector
    • Publication number 20240364034
    • Publication date Oct 31, 2024
    • Tyco Electronics (Shanghai) Co., Ltd.
    • Hengkang Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Connector and Connector Assembly
    • Publication number 20240364028
    • Publication date Oct 31, 2024
    • Tyco Electronics (Shanghai) Co., Ltd.
    • Hengkang Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electrical Connector
    • Publication number 20240283198
    • Publication date Aug 22, 2024
    • Tyco Electronics Holdings (Bermuda) No. 7 Limited
    • Hengkang Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Circuit Board Assembly
    • Publication number 20230030311
    • Publication date Feb 2, 2023
    • Tyco Electronics (Shanghai) Co. Ltd.
    • Ping Hou
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR