Henning Mieth

Person

Jahnsdorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a wafer level package
- Patent number 7,867,817
- Issue date Jan 11, 2011
- Qimonda AG
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a package for semiconductor chips
- Patent number 7,326,593
- Issue date Feb 5, 2008
- Infineon Technologies AG
- Andreas Bischof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support matrix with bonding channel for integrated semiconductors,...
- Patent number 6,979,887
- Issue date Dec 27, 2005
- Infineon Technologies AG
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support matrix for integrated semiconductors, and method for produc...
- Patent number 6,605,864
- Issue date Aug 12, 2003
- Infineon Technologies AG
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Manufacturing a Wafer Level Package
- Publication number 20090194881
- Publication date Aug 6, 2009
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Making Same
- Publication number 20080272503
- Publication date Nov 6, 2008
- Henning Mieth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of producing a package for semiconductor chips
- Publication number 20060211166
- Publication date Sep 21, 2006
- Andreas Bischof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Supporting structure for a chip and method for producing the same
- Publication number 20040159928
- Publication date Aug 19, 2004
- Infineon Technologies AG
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of marking substandard parts
- Publication number 20040022959
- Publication date Feb 5, 2004
- Knut Kahlisch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Support matrix for integrated semiconductors, and method for produc...
- Publication number 20020006688
- Publication date Jan 17, 2002
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support matrix with bonding channel for integrated semiconductors,...
- Publication number 20020003295
- Publication date Jan 10, 2002
- Knut Kahlisch
- H01 - BASIC ELECTRIC ELEMENTS

Henning Mieth

Person

Patents Grantslast 30 patents

Method for manufacturing a wafer level package

Method of producing a package for semiconductor chips

Support matrix with bonding channel for integrated semiconductors,...

Support matrix for integrated semiconductors, and method for produc...

Patents Applicationslast 30 patents

Method for Manufacturing a Wafer Level Package

Semiconductor Device and Method for Making Same

Methods of producing a package for semiconductor chips

Supporting structure for a chip and method for producing the same

Method of marking substandard parts

Support matrix for integrated semiconductors, and method for produc...

Support matrix with bonding channel for integrated semiconductors,...