Henry A. Nye

Person

Brookfield, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for improving adhesion to copper
- Patent number 6,821,890
- Issue date Nov 23, 2004
- International Business Machines Corporation
- Vincent J. McGahay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulative cap for laser fusing
- Patent number 6,784,516
- Issue date Aug 31, 2004
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alpha particle shield for integrated circuit
- Patent number 6,531,759
- Issue date Mar 11, 2003
- International Business Machines Corporation
- Richard A. Wachnik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid dielectric structure for improving the stiffness of back end...
- Patent number 6,486,557
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure and method for reduced downward force wirebonding
- Patent number 6,478,212
- Issue date Nov 12, 2002
- International Business Machines Corporation
- Brett H. Engel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for improving adhesion to copper
- Patent number 6,271,595
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Vincent J. McGahay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crackstop and oxygen barrier for low-K dielectric integrated circuits
- Patent number 6,261,945
- Issue date Jul 17, 2001
- International Business Machines Corporation
- Henry A. Nye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust interconnect structure
- Patent number 6,133,136
- Issue date Oct 17, 2000
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry film resist removal in the presence of electroplated C4's
- Patent number 5,904,156
- Issue date May 18, 1999
- International Business Machines Corporation
- Gerald Gerard Advocate
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electroplated solder terminal
- Patent number 5,629,564
- Issue date May 13, 1997
- International Business Machines Corporation
- Henry A. Nye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated solder terminal
- Patent number 5,503,286
- Issue date Apr 2, 1996
- International Business Machines Corporation
- Henry A. Nye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching processes for avoiding edge stress in semiconductor chip so...
- Patent number 5,268,072
- Issue date Dec 7, 1993
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080206979
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080203585
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080202792
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF CHEMICALLY FORMED ANCHORED METALLIC VIAS
- Publication number 20080012142
- Publication date Jan 17, 2008
- International Business Machines Corporation
- Sanjay C. Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Limiting Metallurgy, Interconnection Structure Including the S...
- Publication number 20080008900
- Publication date Jan 10, 2008
- Yu-Ting Cheng
- B32 - LAYERED PRODUCTS
Information Patent Application
Immersion plating and plated structures
- Publication number 20050238906
- Publication date Oct 27, 2005
- International Business Machines Corporation
- Emanuel I. Cooper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Interconnections for flip-chip using lead-free solders and having r...
- Publication number 20050224966
- Publication date Oct 13, 2005
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball limiting metallurgy, interconnection structure including the s...
- Publication number 20050118437
- Publication date Jun 2, 2005
- International Business Machines Corporation
- Yu-Ting Cheng
- B32 - LAYERED PRODUCTS
Information Patent Application
INHIBITION OF TIN OXIDE FORMATION IN LEAD FREE INTERCONNECT FORMATION
- Publication number 20050026450
- Publication date Feb 3, 2005
- International Business Machines Corporation
- Emanuel I. Cooper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulative cap for laser fusing
- Publication number 20040217384
- Publication date Nov 4, 2004
- Timothy H. Daubespeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Immersion plating and plated structures
- Publication number 20040219384
- Publication date Nov 4, 2004
- International Business Machines Corporation
- Emanuel I. Cooper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Support structures for wirebond regions of contact pads over low mo...
- Publication number 20040058520
- Publication date Mar 25, 2004
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alpha particle shield for integrated circuit
- Publication number 20020105059
- Publication date Aug 8, 2002
- International Business Machines Corporation
- Richard A. Wachnik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving adhesion to copper
- Publication number 20010023987
- Publication date Sep 27, 2001
- Vincent J. Mcgahay
- H01 - BASIC ELECTRIC ELEMENTS

Henry A. Nye

Person

Patents Grantslast 30 patents

Method for improving adhesion to copper

Insulative cap for laser fusing

Alpha particle shield for integrated circuit

Hybrid dielectric structure for improving the stiffness of back end...

Bond pad structure and method for reduced downward force wirebonding

Method for improving adhesion to copper

Crackstop and oxygen barrier for low-K dielectric integrated circuits

Robust interconnect structure

Dry film resist removal in the presence of electroplated C4's

Electroplated solder terminal

Electroplated solder terminal

Etching processes for avoiding edge stress in semiconductor chip so...

Patents Applicationslast 30 patents

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

STRUCTURE AND METHOD OF CHEMICALLY FORMED ANCHORED METALLIC VIAS

Ball Limiting Metallurgy, Interconnection Structure Including the S...

Immersion plating and plated structures

Interconnections for flip-chip using lead-free solders and having r...

Ball limiting metallurgy, interconnection structure including the s...

INHIBITION OF TIN OXIDE FORMATION IN LEAD FREE INTERCONNECT FORMATION

Insulative cap for laser fusing

Immersion plating and plated structures

Support structures for wirebond regions of contact pads over low mo...

Alpha particle shield for integrated circuit

Method for improving adhesion to copper