Henry Descalzo Bathan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming overlapping semiconducto...
- Patent number 9,721,925
- Issue date Aug 1, 2017
- STATS ChipPAC, Pte. Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a wafer level package wi...
- Patent number 9,589,876
- Issue date Mar 7, 2017
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with optical sensor and method of forming inte...
- Patent number 9,525,080
- Issue date Dec 20, 2016
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming leadframe with notched f...
- Patent number 9,472,427
- Issue date Oct 18, 2016
- STATS ChipPAC Pte. Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device having pre-molded leadframe with windo...
- Patent number 9,397,236
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with removable backing element ha...
- Patent number 9,337,161
- Issue date May 10, 2016
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with trace protection layer and...
- Patent number 9,177,897
- Issue date Nov 3, 2015
- Stats Chippac Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with plated leads and method of...
- Patent number 9,142,531
- Issue date Sep 22, 2015
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bump interconnection
- Patent number 9,129,971
- Issue date Sep 8, 2015
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with island terminals and embed...
- Patent number 9,059,151
- Issue date Jun 16, 2015
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with planar interconnect
- Patent number 9,059,074
- Issue date Jun 16, 2015
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with a lead and method of manuf...
- Patent number 9,035,440
- Issue date May 19, 2015
- Stats Chippac Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with a flip chip and method of...
- Patent number 9,034,692
- Issue date May 19, 2015
- Stats Chippac Ltd.
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming EWLB package with stando...
- Patent number 9,006,031
- Issue date Apr 14, 2015
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wafer-level multi-row et...
- Patent number 8,993,376
- Issue date Mar 31, 2015
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with relief
- Patent number 8,981,548
- Issue date Mar 17, 2015
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with array of external interconnects
- Patent number 8,957,515
- Issue date Feb 17, 2015
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched recess package on package system
- Patent number 8,941,219
- Issue date Jan 27, 2015
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with device cavity
- Patent number 8,937,393
- Issue date Jan 20, 2015
- Stats Chippac Ltd.
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with die paddles and method of...
- Patent number 8,936,971
- Issue date Jan 20, 2015
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming similar structure for t...
- Patent number 8,921,983
- Issue date Dec 30, 2014
- STATS ChipPAC, Ltd.
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with lead frame and method of m...
- Patent number 8,912,046
- Issue date Dec 16, 2014
- Stats Chippac Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming overlapping semiconducto...
- Patent number 8,872,320
- Issue date Oct 28, 2014
- STATS ChipPAC, Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with optical sensor and method of forming inte...
- Patent number 8,866,248
- Issue date Oct 21, 2014
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe interposer over semiconductor die and TSV substrate for v...
- Patent number 8,866,275
- Issue date Oct 21, 2014
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with high lead count and method...
- Patent number 8,810,015
- Issue date Aug 19, 2014
- STAT ChipPAC Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with removable backing element ha...
- Patent number 8,810,017
- Issue date Aug 19, 2014
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with plated leads and method of...
- Patent number 8,809,119
- Issue date Aug 19, 2014
- Stats Chippac Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with protective coating and met...
- Patent number 8,803,300
- Issue date Aug 12, 2014
- Stats Chippac Ltd.
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a protective layer on a...
- Patent number 8,802,505
- Issue date Aug 12, 2014
- STATS ChipPAC, Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Overlapping Semiconducto...
- Publication number 20150028496
- Publication date Jan 29, 2015
- STATS ChipPAC, Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package System with Removable Backing Element Ha...
- Publication number 20140332955
- Publication date Nov 13, 2014
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ARRAY CONTACTS AND METHOD...
- Publication number 20140048919
- Publication date Feb 20, 2014
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Semiconductor Device Having Pre-Molded Leadframe with Windo...
- Publication number 20140011315
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Wafer Level Package wi...
- Publication number 20130341789
- Publication date Dec 26, 2013
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFA...
- Publication number 20130154115
- Publication date Jun 20, 2013
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Leadframe Interposer Ove...
- Publication number 20130154076
- Publication date Jun 20, 2013
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL CONNECTION AND METHOD...
- Publication number 20130075883
- Publication date Mar 28, 2013
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming EWLB Package With Stando...
- Publication number 20120326337
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A LEAD AND METHOD OF MANUF...
- Publication number 20120326285
- Publication date Dec 27, 2012
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERLOCK AND METHOD OF MA...
- Publication number 20120299196
- Publication date Nov 29, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Optical Sensor and Method of Forming Inte...
- Publication number 20120286400
- Publication date Nov 15, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Wafer Level Multi-Row Et...
- Publication number 20120273927
- Publication date Nov 1, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REMOVABLE BACKING ELEMENT HA...
- Publication number 20120261808
- Publication date Oct 18, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LOCKING INTERCONNECTS AND...
- Publication number 20120241947
- Publication date Sep 27, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A FLIP CHIP AND METHOD OF...
- Publication number 20120241983
- Publication date Sep 27, 2012
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Leadframe With Notched F...
- Publication number 20120241915
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METH...
- Publication number 20120241926
- Publication date Sep 27, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIPCHIP LEADFRAME AND MET...
- Publication number 20120241928
- Publication date Sep 27, 2012
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...
- Publication number 20120241931
- Publication date Sep 27, 2012
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...
- Publication number 20120241968
- Publication date Sep 27, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLATED LEADS AND METHOD OF...
- Publication number 20120241966
- Publication date Sep 27, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Semiconductor Device having Pre-Molded Leadframe with Windo...
- Publication number 20120168806
- Publication date Jul 5, 2012
- STATS ChipPAC, Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MULTIPLE ROW LEADS AND MET...
- Publication number 20120146203
- Publication date Jun 14, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MOUNTING SYSTEM WITH PADDLE INTERLOCK AND METHOD...
- Publication number 20120146192
- Publication date Jun 14, 2012
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD...
- Publication number 20120139121
- Publication date Jun 7, 2012
- Henry Descalzo Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD...
- Publication number 20120139104
- Publication date Jun 7, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MULTI-ROW LEADS AND METHOD...
- Publication number 20120133033
- Publication date May 31, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION SUPPORTS AND ME...
- Publication number 20120133036
- Publication date May 31, 2012
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Overlapping Semiconducto...
- Publication number 20120119361
- Publication date May 17, 2012
- STATS ChipPAC, Ltd.
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS

Henry Descalzo Bathan

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming overlapping semiconducto...

Semiconductor device and method of forming a wafer level package wi...

Semiconductor device with optical sensor and method of forming inte...

Semiconductor device and method of forming leadframe with notched f...

Optical semiconductor device having pre-molded leadframe with windo...

Integrated circuit package system with removable backing element ha...

Integrated circuit packaging system with trace protection layer and...

Integrated circuit packaging system with plated leads and method of...

Semiconductor device with bump interconnection

Integrated circuit packaging system with island terminals and embed...

Integrated circuit package system with planar interconnect

Integrated circuit packaging system with a lead and method of manuf...

Integrated circuit packaging system with a flip chip and method of...

Semiconductor device and method of forming EWLB package with stando...

Semiconductor device and method of forming wafer-level multi-row et...

Integrated circuit package system with relief

Integrated circuit package system with array of external interconnects

Etched recess package on package system

Integrated circuit package system with device cavity

Integrated circuit packaging system with die paddles and method of...

Semiconductor package and method of forming similar structure for t...

Integrated circuit packaging system with lead frame and method of m...

Semiconductor device and method of forming overlapping semiconducto...

Semiconductor device with optical sensor and method of forming inte...

Leadframe interposer over semiconductor die and TSV substrate for v...

Integrated circuit packaging system with high lead count and method...

Integrated circuit package system with removable backing element ha...

Integrated circuit packaging system with plated leads and method of...

Integrated circuit packaging system with protective coating and met...

Semiconductor device and method of forming a protective layer on a...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Overlapping Semiconducto...

Integrated Circuit Package System with Removable Backing Element Ha...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ARRAY CONTACTS AND METHOD...

Optical Semiconductor Device Having Pre-Molded Leadframe with Windo...

Semiconductor Device and Method of Forming a Wafer Level Package wi...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFA...

Semiconductor Device and Method of Forming Leadframe Interposer Ove...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL CONNECTION AND METHOD...

Semiconductor Device and Method of Forming EWLB Package With Stando...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A LEAD AND METHOD OF MANUF...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERLOCK AND METHOD OF MA...

Semiconductor Device with Optical Sensor and Method of Forming Inte...

Semiconductor Device and Method of Forming Wafer Level Multi-Row Et...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REMOVABLE BACKING ELEMENT HA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LOCKING INTERCONNECTS AND...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A FLIP CHIP AND METHOD OF...

Semiconductor Device and Method of Forming Leadframe With Notched F...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METH...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIPCHIP LEADFRAME AND MET...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD O...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLATED LEADS AND METHOD OF...

Optical Semiconductor Device having Pre-Molded Leadframe with Windo...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MULTIPLE ROW LEADS AND MET...

INTEGRATED CIRCUIT MOUNTING SYSTEM WITH PADDLE INTERLOCK AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MULTI-ROW LEADS AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONNECTION SUPPORTS AND ME...

Semiconductor Device and Method of Forming Overlapping Semiconducto...