Henry IKSAN

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Hong Kong, HK

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Patents Grantslast 30 patents

Information Patent Grant
Cavity chip package
- Patent number 7,339,278
- Issue date Mar 4, 2008
- United Test & Assembly Center Ltd.
- Henry Iksan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAVITY CHIP PACKAGE
- Publication number 20070069371
- Publication date Mar 29, 2007
- United Test & Assembly Center Ltd.
- Henry IKSAN
- H01 - BASIC ELECTRIC ELEMENTS