TREA

Henry Kang

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  • Corvallis, OR, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Stacked adhesive lines
    • Patent number 8,863,388
    • Issue date Oct 21, 2014
    • Hewlett-Packard Development Company, L.P.
    • Chris Aschoff
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Fluid ejection device and methods of fabrication
    • Patent number 8,382,253
    • Issue date Feb 26, 2013
    • Hewlett-Packard Development Company, L.P.
    • Rio Rivas
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Micro electro-mechanical system packaging and interconnect
    • Patent number 8,217,473
    • Issue date Jul 10, 2012
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Packaged MEMS device assembly
    • Patent number 7,723,811
    • Issue date May 25, 2010
    • Hewlett-Packard Development Company, L.P.
    • Charles C Haluzak
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Micro-device packaging
    • Patent number 7,482,682
    • Issue date Jan 27, 2009
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents