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Solder joint encapsulation material
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Patent number 5,759,730
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Issue date Jun 2, 1998
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Delco Electronics Corporation
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Ralph D. Hermansen
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Hot melt epoxy encapsulation material
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Patent number 5,708,056
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Issue date Jan 13, 1998
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Delco Electronics Corporation
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Theresa Renee Lindley
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Polybutadiene urethane potting material
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Patent number 5,608,028
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Issue date Mar 4, 1997
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Delco Electronics Corp.
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Henry M. Sanftleben
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C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Hot melt masking materials
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Patent number 5,460,767
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Issue date Oct 24, 1995
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Delco Electronics Corporation
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Henry M. Sanftleben
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B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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