Henry Xu

Person

Pudong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,837,340
- Issue date Dec 5, 2017
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 9,385,094
- Issue date Jul 5, 2016
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 8,981,573
- Issue date Mar 17, 2015
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 8,963,333
- Issue date Feb 24, 2015
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 8,513,108
- Issue date Aug 20, 2013
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for wireless connection in integrated...
- Patent number 8,084,867
- Issue date Dec 27, 2011
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper plating connection for multi-die stack in substrate package
- Patent number 7,981,726
- Issue date Jul 19, 2011
- Intel Corporation
- John J. Tang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20160379920
- Publication date Dec 29, 2016
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20150187713
- Publication date Jul 2, 2015
- Intel Corporation
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20140042639
- Publication date Feb 13, 2014
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20130334707
- Publication date Dec 19, 2013
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20120108053
- Publication date May 3, 2012
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...
- Publication number 20100244268
- Publication date Sep 30, 2010
- Jiamiao Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper plating connection for multi-die stack in substrate package
- Publication number 20070132082
- Publication date Jun 14, 2007
- Intel Corporation
- John J. Tang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Apparatus, system, and method for wireless connection in integrated...

Apparatus, system, and method for wireless connection in integrated...

Apparatus, system, and method for wireless connection in integrated...

Apparatus, system, and method for wireless connection in integrated...

Apparatus, system, and method for wireless connection in integrated...

Apparatus, system, and method for wireless connection in integrated...

Copper plating connection for multi-die stack in substrate package

Patents Applicationslast 30 patents

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED...

Copper plating connection for multi-die stack in substrate package