Herbert Hopfgartner

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Rothenthurn, AT

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor package with connection lug
- Patent number 12,125,772
- Issue date Oct 22, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with connection lug
- Patent number 11,728,250
- Issue date Aug 15, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Connection Lug
- Publication number 20220375830
- Publication date Nov 24, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Package with Connection Lug
- Publication number 20220375832
- Publication date Nov 24, 2022
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS