Herbert Zidek

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Muenchen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulated electronics device with improved heat dissipation
- Patent number 6,992,400
- Issue date Jan 31, 2006
- Nokia Corporation
- Pasi Tikka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for improving heat dissipation in encapsulated electronic co...
- Publication number 20050167854
- Publication date Aug 4, 2005
- Nokia Corporation
- Pasi Tikka
- H03 - BASIC ELECTRONIC CIRCUITRY