Hermann Vilsmeier

Person

Karlsfeld, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of applying an adhesive layer on thincut semiconductor chips...
- Patent number 8,580,070
- Issue date Nov 12, 2013
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for making semiconductor devices including a foil
- Patent number 7,999,362
- Issue date Aug 16, 2011
- Infineon Technologies AG
- Hannes Mio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through contacts through a plastic hous...
- Patent number 7,944,061
- Issue date May 17, 2011
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with semiconductor chip and rewiring layer and...
- Patent number 7,883,993
- Issue date Feb 8, 2011
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with plastic housing, and process for produ...
- Patent number 7,772,105
- Issue date Aug 10, 2010
- Infineon Technologies AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel and semiconductor device having a composite plate with semico...
- Patent number 7,713,791
- Issue date May 11, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device comprising conductors made of carbonized plastic,...
- Patent number 7,709,379
- Issue date May 4, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit component with a surface-mount housing
- Patent number 7,663,218
- Issue date Feb 16, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and semiconductor wafer, and method for produc...
- Patent number 7,420,262
- Issue date Sep 2, 2008
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with plastic housing, and process for produ...
- Patent number 7,327,023
- Issue date Feb 5, 2008
- Infineon Technologies AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with semiconductor chip and rewiring layer and...
- Patent number 7,091,595
- Issue date Aug 15, 2006
- Infineon Technologies, AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with electromagnetic shielding device
- Patent number 7,009,288
- Issue date Mar 7, 2006
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF APPLYING AN ADHESIVE LAYER ON THINCUT SEMICONDUCTOR CHIPS...
- Publication number 20110155297
- Publication date Jun 30, 2011
- QIMONDA AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MAKING SEMICONDUCTOR DEVICES INCLUDING A FOIL
- Publication number 20090189265
- Publication date Jul 30, 2009
- INFINEON TECHNOLOGIES AG
- Hannes Mio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Through Contacts Through a Plastic Hous...
- Publication number 20080315399
- Publication date Dec 25, 2008
- Infineon Technologies AG
- Michael Bauer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Component with Plastic Housing, and Process for Produ...
- Publication number 20080050907
- Publication date Feb 28, 2008
- INFINEON TECHNOLOGIES AG
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Component with a Surface-Mount Housing and Metho...
- Publication number 20080029874
- Publication date Feb 7, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device Stack and Method for Its Production
- Publication number 20070278639
- Publication date Dec 6, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical device comprising conductors made of carbonized plastic,...
- Publication number 20070113305
- Publication date May 17, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Panel and semiconductor device having a composite plate with semico...
- Publication number 20060265860
- Publication date Nov 30, 2006
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with semiconductor chip and rewiring layer and...
- Publication number 20060246624
- Publication date Nov 2, 2006
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with semiconductor chip and semiconductor wafe...
- Publication number 20060157849
- Publication date Jul 20, 2006
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with plastic housing, and process for produ...
- Publication number 20060076667
- Publication date Apr 13, 2006
- Ulrich Bachmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with semiconductor chip and rewiring layer and...
- Publication number 20050098871
- Publication date May 12, 2005
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with electromagnetic shielding device
- Publication number 20050077596
- Publication date Apr 14, 2005
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and semiconductor wafer, and method for produc...
- Publication number 20040207049
- Publication date Oct 21, 2004
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS

Hermann Vilsmeier

Person

Patents Grantslast 30 patents

Method of applying an adhesive layer on thincut semiconductor chips...

Method and apparatus for making semiconductor devices including a foil

Semiconductor device having through contacts through a plastic hous...

Semiconductor device with semiconductor chip and rewiring layer and...

Semiconductor component with plastic housing, and process for produ...

Panel and semiconductor device having a composite plate with semico...

Electrical device comprising conductors made of carbonized plastic,...

Integrated circuit component with a surface-mount housing

Electronic component and semiconductor wafer, and method for produc...

Semiconductor component with plastic housing, and process for produ...

Semiconductor device with semiconductor chip and rewiring layer and...

Semiconductor component with electromagnetic shielding device

Patents Applicationslast 30 patents

METHOD OF APPLYING AN ADHESIVE LAYER ON THINCUT SEMICONDUCTOR CHIPS...

METHOD AND APPARATUS FOR MAKING SEMICONDUCTOR DEVICES INCLUDING A FOIL

Semiconductor Device Having Through Contacts Through a Plastic Hous...

Semiconductor Component with Plastic Housing, and Process for Produ...

Integrated Circuit Component with a Surface-Mount Housing and Metho...

Semiconductor Device Stack and Method for Its Production

Electrical device comprising conductors made of carbonized plastic,...

Panel and semiconductor device having a composite plate with semico...

Semiconductor device with semiconductor chip and rewiring layer and...

Electronic component with semiconductor chip and semiconductor wafe...

Semiconductor component with plastic housing, and process for produ...

Semiconductor device with semiconductor chip and rewiring layer and...

Semiconductor component with electromagnetic shielding device

Electronic component and semiconductor wafer, and method for produc...