Hermes T. Apale

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Shrewsbury, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming bump pad array on substr...
- Patent number 12,211,778
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- Hermes T. Apale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump pad array on substr...
- Patent number 11,764,136
- Issue date Sep 19, 2023
- STATS ChipPAC Pte. Ltd.
- Hermes T. Apale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 6,960,493
- Issue date Nov 1, 2005
- ST Assembly Test Services, Ltd.
- Virgil C. Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold cap anchoring method for molded flex BGA packages
- Patent number 6,825,067
- Issue date Nov 30, 2004
- ST Assembly Test Services PTE LTD
- Virgil C. Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader interconnect for thermally enhanced PBGA packages
- Patent number 6,818,981
- Issue date Nov 16, 2004
- ST Assembly Test Services PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Bump Pad Array on Substr...
- Publication number 20230307335
- Publication date Sep 28, 2023
- STATS ChipPAC Pte Ltd.
- Hermes T. Apale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Pad Array on Substr...
- Publication number 20230059429
- Publication date Feb 23, 2023
- STATS ChipPAC Pte Ltd.
- Hermes T. Apale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package
- Publication number 20050006668
- Publication date Jan 13, 2005
- ST ASSEMBLY TEST SERVICES LTD.
- Virgil C. Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader interconnect for thermally enhanced PBGA packages
- Publication number 20040155338
- Publication date Aug 12, 2004
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold cap anchoring method for molded flex BGA packages
- Publication number 20040108601
- Publication date Jun 10, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Virgil C. Ararao
- H01 - BASIC ELECTRIC ELEMENTS