Herve Deslandes

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
System and method for fault isolation by emission spectra analysis
- Patent number 10,620,263
- Issue date Apr 14, 2020
- FEI EFA, Inc.
- Herve Deslandes
- G01 - MEASURING TESTING
Information Patent Grant
Optimized wavelength photon emission microscope for VLSI devices
- Patent number 10,514,418
- Issue date Dec 24, 2019
- FEI Company
- Herve Deslandes
- G01 - MEASURING TESTING
Information Patent Grant
In-situ packaging decapsulation feature for electrical fault locali...
- Patent number 10,049,949
- Issue date Aug 14, 2018
- FEI Company
- Tameyasu Anayama
- G02 - OPTICS
Information Patent Grant
System and method for fault isolation by emission spectra analysis
- Patent number 10,041,997
- Issue date Aug 7, 2018
- FEI EFA, Inc.
- Herve Deslandes
- G01 - MEASURING TESTING
Information Patent Grant
Spectral mapping of photo emission
- Patent number 9,903,824
- Issue date Feb 27, 2018
- FEI EFA, Inc.
- Herve Deslandes
- G01 - MEASURING TESTING
Information Patent Grant
Three-dimensional hot spot localization
- Patent number 9,322,715
- Issue date Apr 26, 2016
- DCG Systems, Inc.
- Frank Altmann
- G01 - MEASURING TESTING
Information Patent Grant
Lock in thermal laser stimulation through one side of the device wh...
- Patent number 9,025,020
- Issue date May 5, 2015
- DCG Systems, Inc.
- Herve Deslandes
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Three-dimensional hot spot localization
- Patent number 8,742,347
- Issue date Jun 3, 2014
- DCG Systems, Inc.
- Frank Altmann
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR FAULT ISOLATION BY EMISSION SPECTRA ANALYSIS
- Publication number 20180328985
- Publication date Nov 15, 2018
- FEI EFA, Inc.
- Herve Deslandes
- G01 - MEASURING TESTING
Information Patent Application
IN-SITU PACKAGING DECAPSULATION FEATURE FOR ELECTRICAL FAULT LOCALI...
- Publication number 20170117233
- Publication date Apr 27, 2017
- FEI Company
- Tameyasu Anayama
- G02 - OPTICS
Information Patent Application
OPTIMIZED WAVELENGTH PHOTON EMISSION MICROSCOPE FOR VLSI DEVICES
- Publication number 20170052223
- Publication date Feb 23, 2017
- FEI Company
- Herve Deslandes
- G01 - MEASURING TESTING
Information Patent Application
SPECTRAL MAPPING OF PHOTO EMISSION
- Publication number 20150293037
- Publication date Oct 15, 2015
- DCG SYSTEMS, INC.
- Herve Deslandes
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHOD FOR FAULT ISOLATION BY EMISSION SPECTRA ANALYSIS
- Publication number 20150260789
- Publication date Sep 17, 2015
- DCG SYSTEMS, INC.
- Herve Deslandes
- G01 - MEASURING TESTING
Information Patent Application
Three-Dimensional Hot Spot Localization
- Publication number 20140346360
- Publication date Nov 27, 2014
- DCG SYSTEMS, INC.
- Frank Altmann
- G01 - MEASURING TESTING
Information Patent Application
LOCK IN THERMAL LASER STIMULATION THROUGH ONE SIDE OF THE DEVICE WH...
- Publication number 20120098957
- Publication date Apr 26, 2012
- DCG SYSTEMS, INC.
- Herve DESLANDES
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL HOT SPOT LOCALIZATION
- Publication number 20110297829
- Publication date Dec 8, 2011
- Frank ALTMANN
- G01 - MEASURING TESTING

Herve Deslandes

Person

Patents Grantslast 30 patents

System and method for fault isolation by emission spectra analysis

Optimized wavelength photon emission microscope for VLSI devices

In-situ packaging decapsulation feature for electrical fault locali...

System and method for fault isolation by emission spectra analysis

Spectral mapping of photo emission

Three-dimensional hot spot localization

Lock in thermal laser stimulation through one side of the device wh...

Three-dimensional hot spot localization

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR FAULT ISOLATION BY EMISSION SPECTRA ANALYSIS

IN-SITU PACKAGING DECAPSULATION FEATURE FOR ELECTRICAL FAULT LOCALI...

OPTIMIZED WAVELENGTH PHOTON EMISSION MICROSCOPE FOR VLSI DEVICES

SPECTRAL MAPPING OF PHOTO EMISSION

SYSTEM AND METHOD FOR FAULT ISOLATION BY EMISSION SPECTRA ANALYSIS

Three-Dimensional Hot Spot Localization

LOCK IN THERMAL LASER STIMULATION THROUGH ONE SIDE OF THE DEVICE WH...

THREE-DIMENSIONAL HOT SPOT LOCALIZATION