Heui-Bok Ahn

Person

Gyeonggi-Do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having improved heat-dissipation characteristics
- Patent number 9,613,881
- Issue date Apr 4, 2017
- SK Hynix Inc.
- Heui Gyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backlight image sensor chip having improved chip driving performance
- Patent number 9,543,348
- Issue date Jan 10, 2017
- SILICONFILE TECHNOLOGIES INC.
- Kyoung-Sik Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing through-hole silicon via
- Patent number 9,478,464
- Issue date Oct 25, 2016
- SILICONFILE TECHNOLOGIES INC.
- Heui Gyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack memory
- Patent number 9,406,652
- Issue date Aug 2, 2016
- SILICONFILE TECHNOLOGIES INC.
- Sang Wook Ahn
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for forming pad in wafer with three-dimensional stacking str...
- Patent number 8,993,411
- Issue date Mar 31, 2015
- Siliconfile Technologies Inc.
- Heui-Gyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having wave guide and method for manufacturing the same
- Patent number 8,816,459
- Issue date Aug 26, 2014
- Siliconfile Technologies Inc.
- In-Gyun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illumination image sensor reduced in size and method for...
- Patent number 8,421,134
- Issue date Apr 16, 2013
- Siliconfile Technologies Inc.
- In Gyun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side illumination image sensor reduced in size and method for...
- Patent number 8,420,429
- Issue date Apr 16, 2013
- Siliconfile Technologies Inc.
- In Gyun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming pad in wafer with three-dimensional stacking str...
- Patent number 8,399,282
- Issue date Mar 19, 2013
- Siliconfile Technologies Inc.
- Heui Gyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having wave guide and method for manufacturing the same
- Patent number 8,368,158
- Issue date Feb 5, 2013
- Siliconfile Technologies Inc.
- In-Gyun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit pixel of image sensor having three-dimensional structure and m...
- Patent number 8,193,023
- Issue date Jun 5, 2012
- Siliconfile Technologies Inc.
- Heui-Gyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING PAD OF WAFER
- Publication number 20160372512
- Publication date Dec 22, 2016
- SILICONFILE TECHNOLOGIES INC.
- Heui Gyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PROCESSING PACKAGE AND CAMERA MODULE HAVING SAME
- Publication number 20160373629
- Publication date Dec 22, 2016
- SILICONFILE TECHNOLOGIES INC.
- Huy Chan JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE DATA OUTPUT DEVICE FOR IMAGE SIGNAL PROCESSOR
- Publication number 20160301888
- Publication date Oct 13, 2016
- SILICONFILE TECHNOLOGIES INC.
- Sang Wook AHN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACK MEMORY DEVICE AND METHOD FOR OPERATING SAME
- Publication number 20160267946
- Publication date Sep 15, 2016
- SILICONFILE TECHNOLOGIES INC.
- Sang Wook Ahn
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR APPARATUS HAVING HEAT DISSIPATING FUNCTION AND ELECTR...
- Publication number 20160268373
- Publication date Sep 15, 2016
- SILICONFILE TECHNOLOGIES INC.
- Min Suk KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKLIGHT IMAGE SENSOR CHIP HAVING IMPROVED CHIP DRIVING PERFORMANCE
- Publication number 20160204157
- Publication date Jul 14, 2016
- SILICONFILE TECHNOLOGIES INC.
- Kyoung-Sik PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THROUGH-HOLE SILICON VIA
- Publication number 20160163595
- Publication date Jun 9, 2016
- SILICONFILE TECHNOLOGIES INC.
- Heui Gyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING IMPROVED HEAT-DISSIPATION CHARACTERISTICS
- Publication number 20160086869
- Publication date Mar 24, 2016
- SILICONFILE TECHNOLOGIES INC.
- Heui Gyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR INCLUDING COLOR MICROLENS, AND METHOD FOR MANUFAC...
- Publication number 20150325618
- Publication date Nov 12, 2015
- SiliconFile Technologies Inc.
- Heui Gyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED IMAGE SENSOR HAVING HETEROGENEOUS JUNCTION STRUCTURE A...
- Publication number 20150155323
- Publication date Jun 4, 2015
- SiliconFile Technologies Inc.
- Heui Gyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR TUNGSTEN HEXAFLUORIDE RECOVERY AND REUSE
- Publication number 20140196664
- Publication date Jul 17, 2014
- Air Products and Chemicals, Inc.
- Andrew David Johnson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STR...
- Publication number 20130189828
- Publication date Jul 25, 2013
- Siliconfile Technologies Inc.
- Heui-Gyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATION IMAGE SENSOR REDUCED IN SIZE AND METHOD FOR...
- Publication number 20120301996
- Publication date Nov 29, 2012
- Siliconfile Technologies Inc.
- In-Gyun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING WAVE GUIDE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120295389
- Publication date Nov 22, 2012
- Siliconfile Technologies Inc.
- In-Gyun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STR...
- Publication number 20110207258
- Publication date Aug 25, 2011
- Siliconfile Technologies Inc.
- Heui-Gyun AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ILLUMINATION IMAGE SENSOR REDUCED IN SIZE AND METHOD FOR...
- Publication number 20110156113
- Publication date Jun 30, 2011
- Siliconfile Technologies Inc.
- In-Gyun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING WAVE GUIDE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100264504
- Publication date Oct 21, 2010
- Siliconfile Technologies Inc.
- In-Gyun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT PIXEL OF IMAGE SENSOR HAVING THREE-DIMENSIONAL STRUCTURE AND M...
- Publication number 20100258890
- Publication date Oct 14, 2010
- Siliconfile Technologies Inc.
- Heui-Gyun AHN
- H01 - BASIC ELECTRIC ELEMENTS

Heui-Bok Ahn

Person

Patents Grantslast 30 patents

Semiconductor device having improved heat-dissipation characteristics

Backlight image sensor chip having improved chip driving performance

Method for manufacturing through-hole silicon via

Stack memory

Method for forming pad in wafer with three-dimensional stacking str...

Image sensor having wave guide and method for manufacturing the same

Back side illumination image sensor reduced in size and method for...

Back side illumination image sensor reduced in size and method for...

Method for forming pad in wafer with three-dimensional stacking str...

Image sensor having wave guide and method for manufacturing the same

Unit pixel of image sensor having three-dimensional structure and m...

Patents Applicationslast 30 patents

METHOD FOR FORMING PAD OF WAFER

IMAGE PROCESSING PACKAGE AND CAMERA MODULE HAVING SAME

IMAGE DATA OUTPUT DEVICE FOR IMAGE SIGNAL PROCESSOR

STACK MEMORY DEVICE AND METHOD FOR OPERATING SAME

SEMICONDUCTOR APPARATUS HAVING HEAT DISSIPATING FUNCTION AND ELECTR...

BACKLIGHT IMAGE SENSOR CHIP HAVING IMPROVED CHIP DRIVING PERFORMANCE

METHOD FOR MANUFACTURING THROUGH-HOLE SILICON VIA

SEMICONDUCTOR DEVICE HAVING IMPROVED HEAT-DISSIPATION CHARACTERISTICS

CMOS IMAGE SENSOR INCLUDING COLOR MICROLENS, AND METHOD FOR MANUFAC...

CHIP-STACKED IMAGE SENSOR HAVING HETEROGENEOUS JUNCTION STRUCTURE A...

SYSTEM AND METHOD FOR TUNGSTEN HEXAFLUORIDE RECOVERY AND REUSE

METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STR...

BACK SIDE ILLUMINATION IMAGE SENSOR REDUCED IN SIZE AND METHOD FOR...

IMAGE SENSOR HAVING WAVE GUIDE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FORMING PAD IN WAFER WITH THREE-DIMENSIONAL STACKING STR...

BACK SIDE ILLUMINATION IMAGE SENSOR REDUCED IN SIZE AND METHOD FOR...

IMAGE SENSOR HAVING WAVE GUIDE AND METHOD FOR MANUFACTURING THE SAME

UNIT PIXEL OF IMAGE SENSOR HAVING THREE-DIMENSIONAL STRUCTURE AND M...