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Heui Seog Kim
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Asan-city, KR
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Patents Grants
last 30 patents
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Patent Grant
Leadframe and semiconductor chip package having cutout portions and...
Patent number
6,407,446
Issue date
Jun 18, 2002
Samsung Electronics Co., Ltd.
Je Bong Kang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Leadframe and semiconductor chip package having cutout portions and...
Publication number
20010006250
Publication date
Jul 5, 2001
Je Bong Kang
H01 - BASIC ELECTRIC ELEMENTS