Heung Jae Oh

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Chungcheongnam-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Lead pin for package substrate, and method for manufacturing packag...
- Patent number 8,159,064
- Issue date Apr 17, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Heung Jae Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead pin for package substrate
- Patent number 8,142,240
- Issue date Mar 27, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Heung Jae Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BATTERY PACK CASE
- Publication number 20240194997
- Publication date Jun 13, 2024
- Hyundai Motor Company
- Heung Jun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD PIN FOR PACKAGE SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAG...
- Publication number 20120043653
- Publication date Feb 23, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Heung Jae Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead pin for package substrate
- Publication number 20110014826
- Publication date Jan 20, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Ki Taek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead pin for package substrate
- Publication number 20110014827
- Publication date Jan 20, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Heung Jae Oh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...