Heung Kyu Kwon

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor packages
- Patent number 10,593,652
- Issue date Mar 17, 2020
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 10,403,606
- Issue date Sep 3, 2019
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for routing the package
- Patent number 10,056,321
- Issue date Aug 21, 2018
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System module and mobile computing device including the same
- Patent number 10,025,354
- Issue date Jul 17, 2018
- Samsung Electronics Co., Ltd.
- Heung Kyu Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System on package (SoP) having through silicon via (TSV) interposer...
- Patent number 9,984,032
- Issue date May 29, 2018
- Samsung Electronics Co., Ltd.
- Heung Kyu Kwon
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus for stacked semiconductor packages and methods of fabrica...
- Patent number 9,978,721
- Issue date May 22, 2018
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on packages and mobile computing devices having the same
- Patent number 9,811,122
- Issue date Nov 7, 2017
- Samsung Electronics Co., Ltd.
- Heung Kyu Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having markings and package on package includi...
- Patent number 9,665,122
- Issue date May 30, 2017
- Samsung Electronics Co., Ltd.
- Heung Kyu Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip, flip chip package and wafer level package inclu...
- Patent number 9,640,499
- Issue date May 2, 2017
- Samsung Electronics Co., Ltd.
- Heung Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package including connections electrically co...
- Patent number 9,601,458
- Issue date Mar 21, 2017
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having warpage compensation
- Patent number 9,048,168
- Issue date Jun 2, 2015
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages
- Patent number 9,042,115
- Issue date May 26, 2015
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages having fastening element and halogen-free inter-pack...
- Patent number 9,040,351
- Issue date May 26, 2015
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, package substrates, semiconductor packages,...
- Patent number 8,981,581
- Issue date Mar 17, 2015
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices
- Patent number 8,969,188
- Issue date Mar 3, 2015
- Samsung Electronics Co., Ltd.
- Ki-chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including a plurality of upper semiconductor...
- Patent number 8,963,308
- Issue date Feb 24, 2015
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multi pitch ball land
- Patent number 8,817,486
- Issue date Aug 26, 2014
- Samsung Electronics Co., Ltd.
- Tong-Suk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package including connections electrically co...
- Patent number 8,716,872
- Issue date May 6, 2014
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including a plurality of upper semiconductor...
- Patent number 8,698,301
- Issue date Apr 15, 2014
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, package substrates, semiconductor packages,...
- Patent number 8,680,667
- Issue date Mar 25, 2014
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having passive elements mounted thereonto
- Patent number 8,618,671
- Issue date Dec 31, 2013
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having warpage compensation
- Patent number 8,604,614
- Issue date Dec 10, 2013
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package having electrical connections or vary...
- Patent number 8,546,954
- Issue date Oct 1, 2013
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems employing a stacked semiconductor package
- Patent number 8,508,954
- Issue date Aug 13, 2013
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having multi pitch ball land
- Patent number 8,400,779
- Issue date Mar 19, 2013
- Samsung Electronics Co., Ltd.
- Tong-Suk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package, a method of manufacturing the stack package, and a d...
- Patent number 7,994,643
- Issue date Aug 9, 2011
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack semiconductor package including an interposer chip having an...
- Patent number 7,928,555
- Issue date Apr 19, 2011
- Samsung Electronics Co., Ltd.
- Tae-hun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical stack type multi-chip package having improved grounding pe...
- Patent number 7,868,443
- Issue date Jan 11, 2011
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power ball grid array package, heat spreader used in the BGA p...
- Patent number 7,812,442
- Issue date Oct 12, 2010
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring substrate having variously sized ball pads, semiconductor pa...
- Patent number 7,795,743
- Issue date Sep 14, 2010
- Samsung Electronics Co., Ltd.
- Tae-Hun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...
- Publication number 20190319012
- Publication date Oct 17, 2019
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...
- Publication number 20180331071
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM MODULE AND MOBILE COMPUTING DEVICE INCLUDING THE SAME
- Publication number 20170185107
- Publication date Jun 29, 2017
- Samsung Electronics Co., Ltd.
- HEUNG KYU KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM ON PACKAGE
- Publication number 20170068633
- Publication date Mar 9, 2017
- Samsung Electronics Co., Ltd.
- HEUNG KYU KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING SEMICONDUCTOR P...
- Publication number 20170012025
- Publication date Jan 12, 2017
- Samsung Electronics Co., Ltd.
- Heung-Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, A...
- Publication number 20160358893
- Publication date Dec 8, 2016
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, FLIP CHIP PACKAGE AND WAFER LEVEL PACKAGE INCLU...
- Publication number 20160284655
- Publication date Sep 29, 2016
- Samsung Electronics Co., Ltd.
- Heung Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGES AND MOBILE COMPUTING DEVICES HAVING THE SAME
- Publication number 20160161992
- Publication date Jun 9, 2016
- Heung Kyu KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM OF PACKAGE (SoP) MODULE AND MOBILE COMPUTING DEVICE HAVING T...
- Publication number 20160113115
- Publication date Apr 21, 2016
- HEUNG KYU KWON
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE ON PACKAGE AND COMPUTING DEVICE INCLUDING THE SAME
- Publication number 20160099205
- Publication date Apr 7, 2016
- HEUNG KYU KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, A...
- Publication number 20150228627
- Publication date Aug 13, 2015
- Heung-Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...
- Publication number 20140335657
- Publication date Nov 13, 2014
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION PROCESSOR AND DYNAMIC THERMAL MANAGEMENT METHOD THEREOF
- Publication number 20140324245
- Publication date Oct 30, 2014
- Samsung Electronics Co., Ltd.
- HEUNG-KYU KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE INCLUDING CONNECTIONS ELECTRICALLY CO...
- Publication number 20140193951
- Publication date Jul 10, 2014
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES,...
- Publication number 20140175679
- Publication date Jun 26, 2014
- Samsung Electronics Co., Ltd.
- HEUNG-KYU KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PLURALITY OF UPPER SEMICONDUCTOR...
- Publication number 20140167260
- Publication date Jun 19, 2014
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR ROUTING THE PACKAGE
- Publication number 20140159237
- Publication date Jun 12, 2014
- Heung-Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING WARPAGE COMPENSATION
- Publication number 20140077382
- Publication date Mar 20, 2014
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTIONS OF VARY...
- Publication number 20130334708
- Publication date Dec 19, 2013
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES
- Publication number 20130292828
- Publication date Nov 7, 2013
- Heung-Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING SEMICONDUCTOR P...
- Publication number 20130256916
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Heung-Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER AND METHOD OF FORMING TH...
- Publication number 20130208426
- Publication date Aug 15, 2013
- Samsung Electronics Co., Ltd.
- Jae-Choon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTI PITCH BALL LAND
- Publication number 20130154103
- Publication date Jun 20, 2013
- Samsung Electronics Co., Ltd.
- Tong-Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PLURALITY OF UPPER SEMICONDUCTOR...
- Publication number 20130099373
- Publication date Apr 25, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Heung-Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES,...
- Publication number 20130043584
- Publication date Feb 21, 2013
- Samsung Electronics Co., Ltd.
- HEUNG-KYU KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK PACKAGE APPARATUS
- Publication number 20130009308
- Publication date Jan 10, 2013
- Heung-Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...
- Publication number 20120280404
- Publication date Nov 8, 2012
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE INCLUDING THE S...
- Publication number 20120091597
- Publication date Apr 19, 2012
- Samsung Electronics Co., Ltd.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Fabricating Semiconductor Devices
- Publication number 20120088360
- Publication date Apr 12, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Ki-chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING WARPAGE COMPENSATION
- Publication number 20110233771
- Publication date Sep 29, 2011
- SAMSUNG ELECTRONICS CO., LTD.
- Heung-kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Heung Kyu Kwon

Person

Patents Grantslast 30 patents

Stacked semiconductor packages

Method of fabricating a semiconductor package

Semiconductor package and method for routing the package

System module and mobile computing device including the same

System on package (SoP) having through silicon via (TSV) interposer...

Apparatus for stacked semiconductor packages and methods of fabrica...

Package on packages and mobile computing devices having the same

Semiconductor device having markings and package on package includi...

Semiconductor chip, flip chip package and wafer level package inclu...

Stacked semiconductor package including connections electrically co...

Semiconductor packages having warpage compensation

Stacked semiconductor packages

Stack packages having fastening element and halogen-free inter-pack...

Semiconductor devices, package substrates, semiconductor packages,...

Methods of fabricating semiconductor devices

Semiconductor packages including a plurality of upper semiconductor...

Semiconductor package having multi pitch ball land

Stacked semiconductor package including connections electrically co...

Semiconductor packages including a plurality of upper semiconductor...

Semiconductor devices, package substrates, semiconductor packages,...

Semiconductor packages having passive elements mounted thereonto

Semiconductor packages having warpage compensation

Stacked semiconductor package having electrical connections or vary...

Systems employing a stacked semiconductor package

Semiconductor package having multi pitch ball land

Stack package, a method of manufacturing the stack package, and a d...

Stack semiconductor package including an interposer chip having an...

Vertical stack type multi-chip package having improved grounding pe...

High-power ball grid array package, heat spreader used in the BGA p...

Wiring substrate having variously sized ball pads, semiconductor pa...

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...

STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...

SYSTEM MODULE AND MOBILE COMPUTING DEVICE INCLUDING THE SAME

SYSTEM ON PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING SEMICONDUCTOR P...

STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, A...

SEMICONDUCTOR CHIP, FLIP CHIP PACKAGE AND WAFER LEVEL PACKAGE INCLU...

PACKAGE ON PACKAGES AND MOBILE COMPUTING DEVICES HAVING THE SAME

SYSTEM OF PACKAGE (SoP) MODULE AND MOBILE COMPUTING DEVICE HAVING T...

PACKAGE ON PACKAGE AND COMPUTING DEVICE INCLUDING THE SAME

STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, A...

STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...

APPLICATION PROCESSOR AND DYNAMIC THERMAL MANAGEMENT METHOD THEREOF

STACKED SEMICONDUCTOR PACKAGE INCLUDING CONNECTIONS ELECTRICALLY CO...

SEMICONDUCTOR DEVICES, PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES,...

SEMICONDUCTOR PACKAGES INCLUDING A PLURALITY OF UPPER SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD FOR ROUTING THE PACKAGE

SEMICONDUCTOR PACKAGES HAVING WARPAGE COMPENSATION

STACKED SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTIONS OF VARY...

STACKED SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING SEMICONDUCTOR P...

SEMICONDUCTOR PACKAGE HAVING HEAT SPREADER AND METHOD OF FORMING TH...

SEMICONDUCTOR PACKAGE HAVING MULTI PITCH BALL LAND

SEMICONDUCTOR PACKAGES INCLUDING A PLURALITY OF UPPER SEMICONDUCTOR...

SEMICONDUCTOR DEVICES, PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES,...

SEMICONDUCTOR STACK PACKAGE APPARATUS

STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...

STACKED SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE INCLUDING THE S...

Methods of Fabricating Semiconductor Devices

SEMICONDUCTOR PACKAGES HAVING WARPAGE COMPENSATION