Heung Lak Park

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Wilsonville, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Electroless layer plating process and apparatus
- Patent number 7,897,198
- Issue date Mar 1, 2011
- Novellus Systems, Inc.
- Heung L. Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication of semiconductor interconnect structure
- Patent number 7,531,463
- Issue date May 12, 2009
- Novellus Systems, Inc.
- Daniel A. Koos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabrication of semiconductor interconnect structure with...
- Patent number 7,338,908
- Issue date Mar 4, 2008
- Novellus Systems, Inc.
- Daniel A. Koos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitridation of electrolessly deposited cobalt
- Patent number 6,962,873
- Issue date Nov 8, 2005
- Novellus Systems, Inc.
- Heung L. Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Fabrication of semiconductor interconnect structure
- Publication number 20070105377
- Publication date May 10, 2007
- Novellus Systems, Inc.
- Daniel A. Koos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Liquid treatment using thin liquid layer
- Publication number 20040065540
- Publication date Apr 8, 2004
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR