Heungkyu Kwon

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and operating method
- Patent number 12,167,312
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package including dual stiffener
- Patent number 11,908,758
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid semiconductor device and electronic device
- Patent number 11,908,810
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system
- Patent number 11,658,090
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module including multiple power management semiconduc...
- Patent number 11,600,607
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system
- Patent number 11,244,885
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system
- Patent number 11,075,138
- Issue date Jul 27, 2021
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,069,623
- Issue date Jul 20, 2021
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system
- Patent number 10,991,638
- Issue date Apr 27, 2021
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface temperature management method of mobile device and memory t...
- Patent number 10,198,049
- Issue date Feb 5, 2019
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package-on-package type semiconductor package and method of fabrica...
- Patent number 10,068,881
- Issue date Sep 4, 2018
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip using triple pad configuration and packaging method thereof
- Patent number 9,859,237
- Issue date Jan 2, 2018
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface temperature management method of mobile device and memory t...
- Patent number 9,606,591
- Issue date Mar 28, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages including a metal layer between first and se...
- Patent number 9,390,992
- Issue date Jul 12, 2016
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked memory chips
- Patent number 9,214,441
- Issue date Dec 15, 2015
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 8,981,543
- Issue date Mar 17, 2015
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device and method of fabricating the same
- Patent number 8,952,517
- Issue date Feb 10, 2015
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package
- Patent number 8,709,879
- Issue date Apr 29, 2014
- Samsung Electronics Co., Ltd.
- Ji-hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,426,959
- Issue date Apr 23, 2013
- Samsung Electronics Co., Ltd.
- Ji-hyun Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230144388
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
- Publication number 20230050969
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND OPERATING METHOD
- Publication number 20220272514
- Publication date Aug 25, 2022
- Samsung Electronics Co., Ltd.
- HEUNGKYU KWON
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DUAL STIFFENER
- Publication number 20220208624
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- HEUNGKYU KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20220181274
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- HEUNGKYU KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20210358831
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20210233827
- Publication date Jul 29, 2021
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20200235083
- Publication date Jul 23, 2020
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20200091030
- Publication date Mar 19, 2020
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190355667
- Publication date Nov 21, 2019
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20190348343
- Publication date Nov 14, 2019
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20190348340
- Publication date Nov 14, 2019
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FABRICA...
- Publication number 20170194299
- Publication date Jul 6, 2017
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...
- Publication number 20170185119
- Publication date Jun 29, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20160240509
- Publication date Aug 18, 2016
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP USING TRIPLE PAD CONFIGURATION AND PACKAGING METHOD THEREOF
- Publication number 20160133585
- Publication date May 12, 2016
- HEUNGKYU KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150048521
- Publication date Feb 19, 2015
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A METAL LAYER BETWEEN FIRST AND SE...
- Publication number 20150014862
- Publication date Jan 15, 2015
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140374900
- Publication date Dec 25, 2014
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20140035137
- Publication date Feb 6, 2014
- Samsung Electronics Co., Ltd.
- HEUNGKYU KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20140001653
- Publication date Jan 2, 2014
- Samsung Electronics Co., Ltd.
- HEUNGKYU KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130203219
- Publication date Aug 8, 2013
- Ji-hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...
- Publication number 20130091348
- Publication date Apr 11, 2013
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120299197
- Publication date Nov 29, 2012
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20120074595
- Publication date Mar 29, 2012
- Samsung Electronics Co., Ltd.
- JeongOh Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110042797
- Publication date Feb 24, 2011
- Samsung Electronics Co., Ltd.
- Ji-hyun Park
- H01 - BASIC ELECTRIC ELEMENTS

Heungkyu Kwon

Person

Patents Grantslast 30 patents

Electronic device and operating method

Semiconductor package including dual stiffener

Hybrid semiconductor device and electronic device

Semiconductor package system

Semiconductor module including multiple power management semiconduc...

Semiconductor package system

Semiconductor package system

Semiconductor package

Semiconductor package system

Surface temperature management method of mobile device and memory t...

Package-on-package type semiconductor package and method of fabrica...

Chip using triple pad configuration and packaging method thereof

Semiconductor packages

Surface temperature management method of mobile device and memory t...

Semiconductor packages including a metal layer between first and se...

Semiconductor package including stacked memory chips

Semiconductor package and method of forming the same

Package-on-package device and method of fabricating the same

Method of forming a semiconductor package

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PACKAGE-ON-PACKAGE AND PACKAGE MODULE INCLUDING THE SAME

ELECTRONIC DEVICE AND OPERATING METHOD

SEMICONDUCTOR PACKAGE INCLUDING DUAL STIFFENER

HYBRID SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE SYSTEM

SEMICONDUCTOR PACKAGE SYSTEM

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE SYSTEM

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE SYSTEM

SEMICONDUCTOR PACKAGE SYSTEM

PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FABRICA...

SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...

SEMICONDUCTOR PACKAGES

CHIP USING TRIPLE PAD CONFIGURATION AND PACKAGING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES INCLUDING A METAL LAYER BETWEEN FIRST AND SE...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PACKAGE-ON-PACKAGE DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME