Heyun YIN

Person

Saugus, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sputter etch material selectivity
- Patent number 10,002,764
- Issue date Jun 19, 2018
- Varian Semiconductor Equipment Associates, Inc.
- Kevin Anglin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for processing a substrate having a non-planar surface
- Patent number 8,679,960
- Issue date Mar 25, 2014
- Varian Semiconductor Equipment Associates, Inc.
- George D. Papasouliotis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a substrate having a non-planar substrate sur...
- Patent number 8,507,372
- Issue date Aug 13, 2013
- Varian Semiconductor Equipment Associates, Inc.
- George D. Papasouliotis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a substrate having a non-planar surface
- Patent number 8,202,792
- Issue date Jun 19, 2012
- Varian Semiconductor Equipment Associates, Inc.
- George D. Papasouliotis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantation of multiple species to address copper reliability
- Patent number 7,863,194
- Issue date Jan 4, 2011
- Varian Semiconductor Equipment Associates, Inc.
- Heyun Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantation of multiple species to address copper reliability
- Patent number 7,737,013
- Issue date Jun 15, 2010
- Varian Semiconductor Equipment Associates, Inc.
- Heyun Yin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SPUTTER ETCH MATERIAL SELECTIVITY
- Publication number 20180174843
- Publication date Jun 21, 2018
- Varian Semiconductor Equipment Associates, Inc.
- Kevin Anglin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE HAVING A NON-PLANAR SUBSTRATE SUR...
- Publication number 20120295430
- Publication date Nov 22, 2012
- Varian Semiconductor Equipment Associates, Inc.
- George D. Papasouliotis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for Processing a Substrate Having a Non-Planar Surface
- Publication number 20110086501
- Publication date Apr 14, 2011
- Varian Semiconductor Equipment Associates, Inc.
- George D. Papasouliotis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE HAVING A NON-PLANAR SURFACE
- Publication number 20100273322
- Publication date Oct 28, 2010
- Varian Semiconductor Equipment Associates, Inc.
- George D. Papasouliotis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTATION OF MULTIPLE SPECIES TO ADDRESS COPPER RELIABILITY
- Publication number 20100240201
- Publication date Sep 23, 2010
- VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATE,INC.
- Heyun YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Doped Layers for Reducing Electromigration
- Publication number 20100048018
- Publication date Feb 25, 2010
- Varian Semiconductor Equipment Associates, Inc.
- Atul Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTATION OF MULTIPLE SPECIES TO ADDRESS COPPER RELIABILITY
- Publication number 20090117735
- Publication date May 7, 2009
- Varian Semiconductor Equipment Associates, Inc.
- Heyun YIN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Sputter etch material selectivity

Technique for processing a substrate having a non-planar surface

Method for processing a substrate having a non-planar substrate sur...

Method of processing a substrate having a non-planar surface

Implantation of multiple species to address copper reliability

Implantation of multiple species to address copper reliability

Patents Applicationslast 30 patents

SPUTTER ETCH MATERIAL SELECTIVITY

METHOD FOR PROCESSING A SUBSTRATE HAVING A NON-PLANAR SUBSTRATE SUR...

Technique for Processing a Substrate Having a Non-Planar Surface

METHOD OF PROCESSING A SUBSTRATE HAVING A NON-PLANAR SURFACE

IMPLANTATION OF MULTIPLE SPECIES TO ADDRESS COPPER RELIABILITY

Doped Layers for Reducing Electromigration

IMPLANTATION OF MULTIPLE SPECIES TO ADDRESS COPPER RELIABILITY