Hideaki Fukuzawa

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,177,318
- Issue date Nov 16, 2021
- Agency for Science, Technology and Research
- Teck Guan Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY CELL, MEMORY DEVICE, AND METHODS OF FORMING THE SAME
- Publication number 20210104659
- Publication date Apr 8, 2021
- Agency for Science, Technology and Research
- Hideaki Fukuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20200350363
- Publication date Nov 5, 2020
- Agency for Science, Technology and Research
- Teck Guan Lim
- H01 - BASIC ELECTRIC ELEMENTS