Hideaki Ishizawa

Person

Mishima-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Curable composition for electronic component and connection structure
- Patent number 9,928,934
- Issue date Mar 27, 2018
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive material and connected structure
- Patent number 9,490,046
- Issue date Nov 8, 2016
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive particles, method for producing conductive particles, co...
- Patent number 9,446,484
- Issue date Sep 20, 2016
- Sekisui Chemical Co., Ltd.
- Ryohei Masui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for electronic components
- Patent number 8,901,207
- Issue date Dec 2, 2014
- Sekisui Chemical Co., Ltd.
- Akinobu Hayakawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive material and connection structure
- Patent number 8,802,989
- Issue date Aug 12, 2014
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor chip laminate comprising an adhes...
- Patent number 8,563,362
- Issue date Oct 22, 2013
- Sekisui Chemical Co., Ltd.
- Akinobu Hayakawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process for producing patterned film and photosensitive resin compo...
- Patent number 8,119,323
- Issue date Feb 21, 2012
- Sekisui Chemical Co., Ltd.
- Hiroji Fukui
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Adhesive for electronic components, method for manufacturing semico...
- Patent number 7,915,743
- Issue date Mar 29, 2011
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for electronic component
- Patent number 7,838,577
- Issue date Nov 23, 2010
- Sekisui Chemical Co., Ltd.
- Akinobu Hayakawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Photosensitive amine generator, photocurable composition and photor...
- Patent number 7,262,231
- Issue date Aug 28, 2007
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Acrylic polymer and charge transport material
- Patent number 7,012,123
- Issue date Mar 14, 2006
- Sekisvi Chemical Co., Ltd.
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photoreactive adhesive composition and method of bonding with the same
- Patent number 6,864,300
- Issue date Mar 8, 2005
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Photocurable pressure-sensitive adhesive composition and its sheet
- Patent number 6,641,912
- Issue date Nov 4, 2003
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
LAMINATE, CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING LAMIN...
- Publication number 20230245936
- Publication date Aug 3, 2023
- Sekisui Chemical Co., Ltd
- Taro SHIOJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE MATERIAL AND CONNECTED STRUCTURE
- Publication number 20160086687
- Publication date Mar 24, 2016
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE COMPOSITION FOR ELECTRONIC COMPONENT AND CONNECTION STRUCTURE
- Publication number 20150340120
- Publication date Nov 26, 2015
- SEKISUI CHEMICAL CO., LTD.
- Hideaki Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PARTICLES, METHOD FOR PRODUCING CONDUCTIVE PARTICLES, CO...
- Publication number 20150008022
- Publication date Jan 8, 2015
- Sekisui Chemical Co., Ltd.
- Ryohei Masui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
- Publication number 20140083740
- Publication date Mar 27, 2014
- Hideaki Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
- Publication number 20130000964
- Publication date Jan 3, 2013
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FO PRODUCING SEMICONDUCTOR CHIP STACK, AND SEMICONDUCTOR DEVICE
- Publication number 20120021233
- Publication date Jan 26, 2012
- SEKISUI CHEMICAL CO., LTD.
- Akinobu Hayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR ELECTRONIC COMPONENTS
- Publication number 20120016057
- Publication date Jan 19, 2012
- Akinobu Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FOR ELECTRONIC COMPONENT
- Publication number 20100197830
- Publication date Aug 5, 2010
- Sekisui Chemical Co., Ltd.
- Akinobu Hayakawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FOR ELECTRONIC COMPONENTS
- Publication number 20100076119
- Publication date Mar 25, 2010
- Sekisui Chemical Co., Ltd
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive for electronic components, method and for manufacturing se...
- Publication number 20090311827
- Publication date Dec 17, 2009
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PROCESS FOR PRODUCING PATTERNED FILM AND PHOTOSENSITIVE RESIN COMPO...
- Publication number 20090202942
- Publication date Aug 13, 2009
- Hiroji Fukui
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Photosensitive amine generator, photocurable composition and photor...
- Publication number 20060035995
- Publication date Feb 16, 2006
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Acrylic polymer and charge transport material
- Publication number 20030204036
- Publication date Oct 30, 2003
- Sekisui Chemical Co., Ltd.
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive amine generator, photocurable composition and photor...
- Publication number 20030166738
- Publication date Sep 4, 2003
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photoreactive adhesive composition and method of bonding with the same
- Publication number 20030119978
- Publication date Jun 26, 2003
- Hideaki Ishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photocurable Pressure- Sensitive Adhesive Composition And Its sheet
- Publication number 20030040550
- Publication date Feb 27, 2003
- Hideaki Ishizawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Hideaki Ishizawa

Person

Patents Grantslast 30 patents

Curable composition for electronic component and connection structure

Conductive material and connected structure

Conductive particles, method for producing conductive particles, co...

Adhesive for electronic components

Conductive material and connection structure

Method of producing semiconductor chip laminate comprising an adhes...

Process for producing patterned film and photosensitive resin compo...

Adhesive for electronic components, method for manufacturing semico...

Adhesive for electronic component

Photosensitive amine generator, photocurable composition and photor...

Acrylic polymer and charge transport material

Photoreactive adhesive composition and method of bonding with the same

Photocurable pressure-sensitive adhesive composition and its sheet

Patents Applicationslast 30 patents

LAMINATE, CURABLE RESIN COMPOSITION, METHOD FOR MANUFACTURING LAMIN...

CONDUCTIVE MATERIAL AND CONNECTED STRUCTURE

CURABLE COMPOSITION FOR ELECTRONIC COMPONENT AND CONNECTION STRUCTURE

CONDUCTIVE PARTICLES, METHOD FOR PRODUCING CONDUCTIVE PARTICLES, CO...

CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

METHOD FO PRODUCING SEMICONDUCTOR CHIP STACK, AND SEMICONDUCTOR DEVICE

ADHESIVE FOR ELECTRONIC COMPONENTS

ADHESIVE FOR ELECTRONIC COMPONENT

ADHESIVE FOR ELECTRONIC COMPONENTS

Adhesive for electronic components, method and for manufacturing se...

PROCESS FOR PRODUCING PATTERNED FILM AND PHOTOSENSITIVE RESIN COMPO...

Photosensitive amine generator, photocurable composition and photor...

Acrylic polymer and charge transport material

Photosensitive amine generator, photocurable composition and photor...

Photoreactive adhesive composition and method of bonding with the same

Photocurable Pressure- Sensitive Adhesive Composition And Its sheet