Hideaki Matsubara

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing method of and substrate processing apparatus f...
- Patent number 7,410,545
- Issue date Aug 12, 2008
- Dainippon Screen Mfg. Co., Ltd.
- Hideaki Matsubara
- B08 - CLEANING
Information Patent Grant
Plating apparatus, cartridge and copper dissolution tank for use in...
- Patent number 7,279,079
- Issue date Oct 9, 2007
- Dainippon Screen Mfg. Co., Ltd.
- Yasuhiro Mizohata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plating apparatus, plating cup and cathode ring
- Patent number 7,169,269
- Issue date Jan 30, 2007
- Dainippon Screen Mfg. Co., Ltd.
- Yasuhiro Mizohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-destructive measuring sensor for semiconductor wafer and method...
- Patent number 5,554,939
- Issue date Sep 10, 1996
- Dainippon Screen Manufacturing Co., Ltd.
- Sadao Hirae
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for electrical measurement of semiconductor wa...
- Patent number 5,504,437
- Issue date Apr 2, 1996
- Dainippon Screen Mfg. Co., Ltd.
- Sadao Hirae
- G01 - MEASURING TESTING
Information Patent Grant
Method of measuring electric charge of semiconductor wafer
- Patent number 5,475,319
- Issue date Dec 12, 1995
- Dainippon Screen Mfg. Co., Ltd.
- Sadao Hirae
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PLATING APPARATUS, CARTRIDGE AND COPPER DISSOLUTION TANK FOR USE IN...
- Publication number 20070235341
- Publication date Oct 11, 2007
- Dainippon Screen Mfg. Co., Ltd.
- Yasuhiro Mizohata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20070221254
- Publication date Sep 27, 2007
- Akira Izumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS, PLATING CUP AND CATHODE RING
- Publication number 20070080057
- Publication date Apr 12, 2007
- Dainippon Screen Mfg. Co., Ltd.
- Yasuhiro Mizohata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS, PLATING CUP AND CATHODE RING
- Publication number 20070023277
- Publication date Feb 1, 2007
- Dainippon Screen Mfg. Co., Ltd.
- Yasuhiro Mizohata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate processing method of and substrate processing apparatus f...
- Publication number 20060266382
- Publication date Nov 30, 2006
- Dainippon Screen Mfg. Co., Ltd.
- Hideaki Matsubara
- B08 - CLEANING
Information Patent Application
Plating apparatus, plating cup and cathode ring
- Publication number 20040140199
- Publication date Jul 22, 2004
- Dainippon Screen Mfg. Co., Ltd.
- Yasuhiro Mizohata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20040084315
- Publication date May 6, 2004
- Dainippon Screen Mfg. Co., Ltd.
- Yasuhiro Mizohata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus, cartridge and copper dissolution tank for use in...
- Publication number 20040069647
- Publication date Apr 15, 2004
- Yasuhiro Mizohata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Hideaki Matsubara

Person

Patents Grantslast 30 patents

Substrate processing method of and substrate processing apparatus f...

Plating apparatus, cartridge and copper dissolution tank for use in...

Plating apparatus, plating cup and cathode ring

Non-destructive measuring sensor for semiconductor wafer and method...

Apparatus and method for electrical measurement of semiconductor wa...

Method of measuring electric charge of semiconductor wafer

Patents Applicationslast 30 patents

PLATING APPARATUS, CARTRIDGE AND COPPER DISSOLUTION TANK FOR USE IN...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

PLATING APPARATUS, PLATING CUP AND CATHODE RING

PLATING APPARATUS, PLATING CUP AND CATHODE RING

Substrate processing method of and substrate processing apparatus f...

Plating apparatus, plating cup and cathode ring

Plating apparatus and plating method

Plating apparatus, cartridge and copper dissolution tank for use in...