Hideaki Matsunaga

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Beppu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Frame design in embedded die package
- Patent number 12,154,861
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interdigitated mold arrangement
- Patent number 11,942,384
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multilayer mold
- Patent number 10,879,144
- Issue date Dec 29, 2020
- Texas Instruments Incorporated
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FRAME DESIGN IN EMBEDDED DIE PACKAGE
- Publication number 20250087591
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD COMPOUND TRENCHES TO FACILITATE PACKAGE SINGULATION
- Publication number 20250079247
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT
- Publication number 20230137762
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME DESIGN IN EMBEDDED DIE PACKAGE
- Publication number 20210134729
- Publication date May 6, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MULTILAYER MOLD
- Publication number 20200058570
- Publication date Feb 20, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Kengo Aoya
- H01 - BASIC ELECTRIC ELEMENTS