Hideaki Murata

Person

Nagasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wireless power supply device, telemetric measuring system, rotating...
- Patent number 10,784,724
- Issue date Sep 22, 2020
- Mitsubishi Heavy Industries, Ltd.
- Naoki Oyama
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Grant
Location detecting system and location detecting method of the loca...
- Patent number 10,228,253
- Issue date Mar 12, 2019
- MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD.
- Hideaki Murata
- G01 - MEASURING TESTING
Information Patent Grant
Position measurement method, own position measurement device, and o...
- Patent number 10,094,671
- Issue date Oct 9, 2018
- MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD.
- Kazuumi Kondo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
On-board unit, communication method, and recording medium
- Patent number 9,660,705
- Issue date May 23, 2017
- MITSUBISHI HEAVY INDUSTRIES MECHATRONICS SYSTEMS, LTD.
- Takeshi Nagata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vehicle communication system, on-board unit, recording medium and c...
- Patent number 9,560,213
- Issue date Jan 31, 2017
- MITSUBISHI HEAVY INDUSTRIES MECHATRONICS SYSTEMS, LTD.
- Takeshi Nagata
- G07 - CHECKING-DEVICES
Information Patent Grant
Inspection device and inspection method for boiler furnace water wa...
- Patent number 8,786,867
- Issue date Jul 22, 2014
- Mitsubishi Heavy Industries, Ltd.
- Hirotoshi Matsumoto
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device package
- Patent number 6,900,526
- Issue date May 31, 2005
- The Furukawa Electric Co., Ltd.
- Takahiro Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 6,597,060
- Issue date Jul 22, 2003
- The Furukawa Electric Co., Ltd.
- Takahiro Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor element package and manufacturing method thereof
- Patent number 6,440,778
- Issue date Aug 27, 2002
- The Furukawa Electric Co., Ltd.
- Takahiro Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module package and method for manufacturing the same
- Patent number 6,123,464
- Issue date Sep 26, 2000
- The Furukawa Electric Co., Ltd.
- Hideaki Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for optical semiconductor element and method for manufactur...
- Patent number 5,804,865
- Issue date Sep 8, 1998
- The Furukawa Electric Co., Ltd.
- Masato Sakata
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
WIRELESS POWER SUPPLY DEVICE, TELEMETRIC MEASURING SYSTEM, ROTATING...
- Publication number 20190181689
- Publication date Jun 13, 2019
- Mitsubishi Heavy Industries, Ltd.
- Naoki OYAMA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LOCATION DETECTING SYSTEM AND LOCATION DETECTING METHOD OF THE LOCA...
- Publication number 20160370189
- Publication date Dec 22, 2016
- Mitsubishi Heavy Industries Mechatronics Systems, Ltd.
- Hideaki MURATA
- G01 - MEASURING TESTING
Information Patent Application
POSITION MEASUREMENT METHOD, OWN POSITION MEASUREMENT DEVICE, AND O...
- Publication number 20160341557
- Publication date Nov 24, 2016
- Mitsubishi Heavy Industries Mechatronics Systems, Ltd.
- Kazuumi KONDO
- G01 - MEASURING TESTING
Information Patent Application
VEHICLE COMMUNICATION SYSTEM, ON-BOARD UNIT, RECORDING MEDIUM AND C...
- Publication number 20150358481
- Publication date Dec 10, 2015
- Mitsubishi Heavy Industries, Ltd.
- Takeshi NAGATA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ON-BOARD UNIT, COMMUNICATION METHOD, AND RECORDING MEDIUM
- Publication number 20150326283
- Publication date Nov 12, 2015
- Mitsubishi Heavy Industries, Ltd.
- Takeshi NAGATA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INSPECTION DEVICE AND INSPECTION METHOD FOR BOILER FURNACE WATER WA...
- Publication number 20110279828
- Publication date Nov 17, 2011
- Mitsubishi Heavy Industries, Ltd.
- Hirotoshi Matsumoto
- F22 - STEAM GENERATION
Information Patent Application
Semiconductor device package
- Publication number 20030209795
- Publication date Nov 13, 2003
- The Furukawa Electric CO., LTD
- Takahiro Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser diode module and mounting board
- Publication number 20020048295
- Publication date Apr 25, 2002
- THE FURUKAWA ELECTRIC CO., LTD.
- Tomoya Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package
- Publication number 20010030358
- Publication date Oct 18, 2001
- THE FURUKAWA ELECTRIC CO., LTD.
- Takahiro Okada
- H01 - BASIC ELECTRIC ELEMENTS

Hideaki Murata

Person

Patents Grantslast 30 patents

Wireless power supply device, telemetric measuring system, rotating...

Location detecting system and location detecting method of the loca...

Position measurement method, own position measurement device, and o...

On-board unit, communication method, and recording medium

Vehicle communication system, on-board unit, recording medium and c...

Inspection device and inspection method for boiler furnace water wa...

Semiconductor device package

Semiconductor device package

Optical semiconductor element package and manufacturing method thereof

Optical module package and method for manufacturing the same

Package for optical semiconductor element and method for manufactur...

Patents Applicationslast 30 patents

WIRELESS POWER SUPPLY DEVICE, TELEMETRIC MEASURING SYSTEM, ROTATING...

LOCATION DETECTING SYSTEM AND LOCATION DETECTING METHOD OF THE LOCA...

POSITION MEASUREMENT METHOD, OWN POSITION MEASUREMENT DEVICE, AND O...

VEHICLE COMMUNICATION SYSTEM, ON-BOARD UNIT, RECORDING MEDIUM AND C...

ON-BOARD UNIT, COMMUNICATION METHOD, AND RECORDING MEDIUM

INSPECTION DEVICE AND INSPECTION METHOD FOR BOILER FURNACE WATER WA...

Semiconductor device package

Laser diode module and mounting board

Semiconductor device package