Hideaki Seto

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Tsukuba, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate laser marking
- Patent number 7,371,659
- Issue date May 13, 2008
- LSI Logic Corporation
- Haruhiko Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer chucking apparatus for spin processor
- Patent number 7,201,176
- Issue date Apr 10, 2007
- LSI Logic Corporation
- Kyoko Kuroki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chucking apparatus and method for spin processor
- Patent number 7,056,392
- Issue date Jun 6, 2006
- LSI Logic Corporation
- Kyoko Kuroki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-airlock apparatus for filters
- Patent number 6,299,723
- Issue date Oct 9, 2001
- LSI Logic Corporation
- Hideaki Seto
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Anti-microbubble deposition apparatus
- Patent number 6,276,379
- Issue date Aug 21, 2001
- LSI Logic Corporation
- Hideaki Seto
- B08 - CLEANING
Information Patent Grant
Method for removing particles from a semiconductor wafer
- Patent number 6,248,180
- Issue date Jun 19, 2001
- LSI Logic Corporation
- Nobuyoshi Sato
- B08 - CLEANING
Information Patent Grant
Liquid level sensor for buffered hydrofluoric acid
- Patent number 6,032,529
- Issue date Mar 7, 2000
- LSI Logic Corporation
- Kyoko Saito
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Substrate Laser Marking
- Publication number 20080135981
- Publication date Jun 12, 2008
- LSI Corporation
- Haruhiko Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR