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Hideaki Seuzaki

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  • Fukuoka, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of resin sealing semiconductor devices
    • Patent number 5,059,379
    • Issue date Oct 22, 1991
    • Mitsubishi Denki Kabushiki Kaisha
    • Yasutsugu Tsutsumi
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL