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Hideaki Suezaki
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Fukuoka, JP
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last 30 patents
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Patent Grant
Device for resin sealing semiconductor devices
Patent number
4,983,111
Issue date
Jan 8, 1991
Mitsubishi Denki Kabushiki Kaisha
Yasutsugu Tsutsumi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Patent Grant
Device for resin sealing semiconductor devices
Patent number
4,915,608
Issue date
Apr 10, 1990
Mitsubishi Denki Kabushiki Kaisha
Yasutsugu Tsutsumi
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL