Hideaki Yoshimi

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Gunma, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method
- Patent number 9,917,010
- Issue date Mar 13, 2018
- Semiconductor Components Industries, LLC
- Hideaki Yoshimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of automatically inspecting an appe...
- Patent number 8,809,076
- Issue date Aug 19, 2014
- Semiconductor Components Industries, LLC
- Hideaki Yoshimi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,736,047
- Issue date May 27, 2014
- Semiconductor Components Industries, LLC
- Hideaki Yoshimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded semiconductor device and manufacturing method thereof
- Patent number 8,648,452
- Issue date Feb 11, 2014
- Sanyo Semiconductor Co., Ltd.
- Kiyoshi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded semiconductor device and manufacturing method thereof
- Patent number 7,998,794
- Issue date Aug 16, 2011
- Sanyo Electric Co., Ltd.
- Kiyoshi Saito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20140220739
- Publication date Aug 7, 2014
- Semiconductor Components Industries, LLC
- Hideaki Yoshimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140027894
- Publication date Jan 30, 2014
- Semiconductor Components Industries, LLC
- Kiyoshi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF AUTOMATICALLY INSPECTING AN APPE...
- Publication number 20130192078
- Publication date Aug 1, 2013
- Hideaki YOSHIMI
- G01 - MEASURING TESTING
Information Patent Application
RESIN MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110260311
- Publication date Oct 27, 2011
- SANYO SEMICONDUCTOR CO., LTD.
- Kiyoshi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100052138
- Publication date Mar 4, 2010
- SANYO ELECTRIC CO., LTD.
- Kiyoshi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20070228554
- Publication date Oct 4, 2007
- Sanyo Electric Co., Ltd.
- Hideaki Yoshimi
- H01 - BASIC ELECTRIC ELEMENTS