Hidebumi Ohnuki

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a multilayered printed wiring board
- Patent number 5,526,564
- Issue date Jun 18, 1996
- NEC Corporation
- Tutomu Ohshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of and apparatus for plating printed circuit board
- Patent number 5,480,675
- Issue date Jan 2, 1996
- NEC Corporation
- Tomoo Murakami
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multilayered printed wiring board and method of manufacturing the same
- Patent number 5,455,393
- Issue date Oct 3, 1995
- NEC Corporation
- Tutomu Ohshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing printed wiring boards
- Patent number 5,218,761
- Issue date Jun 15, 1993
- NEC Corporation
- Ryo Maniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making multi-layer printed wiring boards
- Patent number 4,668,332
- Issue date May 26, 1987
- NEC Corporation
- Hidebumi Ohnuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR