Hidefumi Ueda

Follow

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder paste and soldering method of the same
- Patent number 6,656,291
- Issue date Dec 2, 2003
- Fujitsu Limited
- Hidefumi Ueda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-forming method using two plates and electronic device
- Patent number 6,528,346
- Issue date Mar 4, 2003
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating solder bumps by forming solder balls with a...
- Patent number 6,025,258
- Issue date Feb 15, 2000
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming solder balls on a plate having apertures using...
- Patent number 5,643,831
- Issue date Jul 1, 1997
- Fujitsu Limited
- Masayuki Ochiai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Bump-forming method using two plates and electronic device
- Publication number 20010018263
- Publication date Aug 30, 2001
- Masayuki Ochiai
- H01 - BASIC ELECTRIC ELEMENTS