Hideharu KOBASHI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus and manufacturing method for semiconductor de...
- Patent number 11,692,947
- Issue date Jul 4, 2023
- FASFORD TECHNOLOGY CO., LTD.
- Yuta Ono
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 8,574,933
- Issue date Nov 5, 2013
- Renesas Electronics Corporation
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 8,367,433
- Issue date Feb 5, 2013
- Renesas Electronics Corporation
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 7,824,932
- Issue date Nov 2, 2010
- Renesas Electronics Corporation
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, INSPECTION APPARATUS, AND MA...
- Publication number 20230215770
- Publication date Jul 6, 2023
- Fasford Technology Co., Ltd.
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor Ap...
- Publication number 20220199433
- Publication date Jun 23, 2022
- Fasford Technology Co., Ltd.
- Hideharu Kobashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor De...
- Publication number 20220034823
- Publication date Feb 3, 2022
- Fasford Technology Co., Ltd.
- Yuta ONO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20130122615
- Publication date May 16, 2013
- RENESAS ELECTRONICS CORPORATION
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20100285615
- Publication date Nov 11, 2010
- RENESAS TECHNOLOGY CORP.
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090215204
- Publication date Aug 27, 2009
- RENESAS TECHNOLOGY CORP.
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20080057599
- Publication date Mar 6, 2008
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS

Hideharu KOBASHI

Person

Patents Grantslast 30 patents

Die bonding apparatus and manufacturing method for semiconductor de...

Fabrication method of semiconductor device

Fabrication method of semiconductor device

Fabrication method of semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING APPARATUS, INSPECTION APPARATUS, AND MA...

Die Bonding Apparatus and Manufacturing Method for Semiconductor Ap...

Die Bonding Apparatus and Manufacturing Method for Semiconductor De...

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

FABRICATION METHOD OF SEMICONDUCTOR DEVICE