Membership
Tour
Register
Log in
Hideharu Miyake
Follow
Person
Tokyo, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device having a liquid cooling module
Patent number
8,937,390
Issue date
Jan 20, 2015
PS4 Luxco S.A.R.L.
Nae Hisano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a liquid cooling module
Patent number
8,704,352
Issue date
Apr 22, 2014
Nae Hisano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer of circuit board and joining structure of wafer or circuit board
Patent number
8,334,465
Issue date
Dec 18, 2012
Elpida Memory, Inc.
Masakazu Ishino
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor chip with a porous single crystal layer and manufactu...
Patent number
7,632,696
Issue date
Dec 15, 2009
Elpida Memory, Inc.
Kiyonori Oyu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device having improved stacked capacitor cells
Patent number
5,981,989
Issue date
Nov 9, 1999
NEC Corporation
Hideharu Miyake
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a semiconductor memory device having stacked...
Patent number
5,403,766
Issue date
Apr 4, 1995
NEC Corporation
Hideharu Miyake
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device and its fabrication method
Patent number
5,383,152
Issue date
Jan 17, 1995
NEC Corporation
Hideharu Miyake
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Intermittent etching process
Patent number
4,790,903
Issue date
Dec 13, 1988
University of Tokyo
Takuo Sugano
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Unidirectional single-flux-quantum logic circuit
Patent number
4,678,945
Issue date
Jul 7, 1987
University of Tokyo
Takuo Sugano
H03 - BASIC ELECTRONIC CIRCUITRY
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
Publication number
20140183730
Publication date
Jul 3, 2014
Nae HISANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD
Publication number
20130140067
Publication date
Jun 6, 2013
Elpida Memory, Inc.
Masakazu Ishino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
Publication number
20100171213
Publication date
Jul 8, 2010
Elpida Memory, Inc.
Nae HISANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FIELD EFFECT TRANSISTOR FOR PREVENTING COLLAPSE OR DEFORMATION OF A...
Publication number
20100072552
Publication date
Mar 25, 2010
Elpida Memory,Inc.
Hideo SUNAMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS
Publication number
20090134498
Publication date
May 28, 2009
Elpida Memory, Inc.
Hiroaki IKEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer of circuit board and joining structure of wafer or circuit board
Publication number
20090109641
Publication date
Apr 30, 2009
Elpida Memory, Inc.
Masakazu Ishino
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Semiconductor chip with a porous single crystal layer and manufactu...
Publication number
20060249075
Publication date
Nov 9, 2006
Kiyonori Oyu
H01 - BASIC ELECTRIC ELEMENTS