Hidehiko Akasaki

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin molded semiconductor device and method of manufacturing semic...
- Patent number 6,166,433
- Issue date Dec 26, 2000
- Fujitsu Limited
- Akira Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer testing method with probe pin contact
- Patent number 6,063,640
- Issue date May 16, 2000
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 5,861,670
- Issue date Jan 19, 1999
- Fujitsu Limited
- Hidehiko Akasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device module
- Patent number 4,737,884
- Issue date Apr 12, 1988
- Fujitsu Limited
- Kensaku Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a package for a semiconductor device
- Patent number 4,710,250
- Issue date Dec 1, 1987
- Fujitsu Limited
- Haruo Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular semiconductor device
- Patent number 4,689,658
- Issue date Aug 25, 1987
- Fujitsu Limited
- Hidehiko Akasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including leadless packages and a base plate f...
- Patent number 4,682,207
- Issue date Jul 21, 1987
- Fujitsu Limited
- Hidehiko Akasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid integrated circuit device
- Patent number 4,539,622
- Issue date Sep 3, 1985
- Fujitsu Limited
- Hidehiko Akasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for enclosing semiconductor elements
- Patent number 4,458,291
- Issue date Jul 3, 1984
- Fujitsu Limited
- Mamoru Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS

Hidehiko Akasaki

Person

Patents Grantslast 30 patents

Resin molded semiconductor device and method of manufacturing semic...

Semiconductor wafer testing method with probe pin contact

Semiconductor device package

Semiconductor device module

Method for producing a package for a semiconductor device

Modular semiconductor device

Semiconductor device including leadless packages and a base plate f...

Hybrid integrated circuit device

Package for enclosing semiconductor elements