Hidehiko Okuda

Person

Imari-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
P-type silicon wafer and method for heat-treating the same
- Patent number 7,939,441
- Issue date May 10, 2011
- Sumco Corporation
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing bonded wafer
- Patent number 7,767,549
- Issue date Aug 3, 2010
- Sumco Corporation
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for regenerating layer transferred wafer
- Patent number 7,763,541
- Issue date Jul 27, 2010
- Sumco Corporation
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer
- Patent number 7,745,306
- Issue date Jun 29, 2010
- Sumco Corporation
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P-type silicon wafer and method for heat-treating the same
- Patent number 7,541,663
- Issue date Jun 2, 2009
- Sumco Corporation
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 7,416,960
- Issue date Aug 26, 2008
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 7,364,984
- Issue date Apr 29, 2008
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 7,354,844
- Issue date Apr 8, 2008
- Sumco Corporation
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for heat-treating silicon wafer and silicon wafer
- Patent number 7,311,775
- Issue date Dec 25, 2007
- Sumco Corporation
- Tatsumi Kusaba
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PRODUCING BONDED SUBSTRATE
- Publication number 20110065258
- Publication date Mar 17, 2011
- SUMCO CORPORATION
- Hidehiko OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING BONDED WAFER
- Publication number 20100144131
- Publication date Jun 10, 2010
- SUMCO CORPORATION
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-TYPE SILICON WAFER AND METHOD FOR HEAT-TREATING THE SAME
- Publication number 20090233420
- Publication date Sep 17, 2009
- SUMCO CORPORATION
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing bonded wafer
- Publication number 20090186464
- Publication date Jul 23, 2009
- SUMCO CORPORATION
- Nobuyuki Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing bonded wafer
- Publication number 20080213974
- Publication date Sep 4, 2008
- SUMCO CORPORATION
- Hidehiko OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Regenerating Layer Transferred Wafer and Layer Transfer...
- Publication number 20080124929
- Publication date May 29, 2008
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing bonded wafer
- Publication number 20080020514
- Publication date Jan 24, 2008
- SUMCO CORPORATION
- Hidehiko Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing SOI Substrate
- Publication number 20080014716
- Publication date Jan 17, 2008
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing SOI Substrate
- Publication number 20080014717
- Publication date Jan 17, 2008
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing SOI substrate
- Publication number 20060177993
- Publication date Aug 10, 2006
- Akihiko Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for heat-treating silicon wafer and silicon wafer
- Publication number 20060027161
- Publication date Feb 9, 2006
- SUMCO CORPORATION
- Tatsumi Kusaba
- C30 - CRYSTAL GROWTH
Information Patent Application
P-type silicon wafer and method for heat-treating the same
- Publication number 20060027897
- Publication date Feb 9, 2006
- SUMCO CORPORATION
- Tatsumi Kusaba
- H01 - BASIC ELECTRIC ELEMENTS

Hidehiko Okuda

Person

Patents Grantslast 30 patents

P-type silicon wafer and method for heat-treating the same

Method of manufacturing bonded wafer

Process for regenerating layer transferred wafer

Method for producing bonded wafer

P-type silicon wafer and method for heat-treating the same

Method for manufacturing SOI substrate

Method for manufacturing SOI substrate

Method for manufacturing SOI substrate

Method for heat-treating silicon wafer and silicon wafer

Patents Applicationslast 30 patents

METHOD OF PRODUCING BONDED SUBSTRATE

METHOD FOR PRODUCING BONDED WAFER

P-TYPE SILICON WAFER AND METHOD FOR HEAT-TREATING THE SAME

Method for producing bonded wafer

Method of manufacturing bonded wafer

Process for Regenerating Layer Transferred Wafer and Layer Transfer...

Method for producing bonded wafer

Method for Manufacturing SOI Substrate

Method for Manufacturing SOI Substrate

Method for manufacturing SOI substrate

Method for heat-treating silicon wafer and silicon wafer

P-type silicon wafer and method for heat-treating the same