Hidehiro Maeda

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 12,165,902
- Issue date Dec 10, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding device, and holding member
- Patent number 12,080,554
- Issue date Sep 3, 2024
- Nikon Corporation
- Hajime Mitsuishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method, bonding device, and holding member
- Patent number 11,004,686
- Issue date May 11, 2021
- Nikon Corporation
- Hajime Mitsuishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered substrate manufacturing method
- Patent number 10,714,351
- Issue date Jul 14, 2020
- Nikon Corporation
- Hidehiro Maeda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate holder, substrate holder unit, substrate transport appara...
- Patent number 9,240,339
- Issue date Jan 19, 2016
- Nikon Corporation
- Hidehiro Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder system, substrate holder, fastening mechanism, sub...
- Patent number 9,054,140
- Issue date Jun 9, 2015
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 9,015,930
- Issue date Apr 28, 2015
- Nikon Corporation
- Hidehiro Maeda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate holder, substrate holder unit, substrate transport appara...
- Patent number 8,570,704
- Issue date Oct 29, 2013
- Nikon Corporation
- Hidehiro Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transport method and transport apparatus
- Patent number 8,489,227
- Issue date Jul 16, 2013
- Nikon Corporation
- Hidehiro Maeda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Transport method and transport apparatus
- Patent number 8,244,399
- Issue date Aug 14, 2012
- Nikon Corporation
- Hidehiro Maeda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20240387177
- Publication date Nov 21, 2024
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL DEVICE, CONTROL METHOD, AND PROGRAM
- Publication number 20230052396
- Publication date Feb 16, 2023
- Nikon Corporation
- Hidehiro MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20220084870
- Publication date Mar 17, 2022
- Nikon Corporation
- Hajime MITSUISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20210225651
- Publication date Jul 22, 2021
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20190267238
- Publication date Aug 29, 2019
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HOLDER AND SUBSTRATE BONDING APPARATUS
- Publication number 20140345805
- Publication date Nov 27, 2014
- Hidehiro MAEDA
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE HOLDER, SUBSTRATE HOLDER UNIT, SUBSTRATE TRANSPORT APPARA...
- Publication number 20140036403
- Publication date Feb 6, 2014
- Nikon Corporation
- Hidehiro Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transport Method and Transport Apparatus
- Publication number 20130274915
- Publication date Oct 17, 2013
- Hidehiro Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDING UNIT, SUBSTRATE BONDING APPARATUS, MULTI-LAYERED...
- Publication number 20130157438
- Publication date Jun 20, 2013
- Nikon Corporation
- Hidehiro MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transport Method and Transport Apparatus
- Publication number 20120330459
- Publication date Dec 27, 2012
- Nikon Corporation
- Hidehiro MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER, PAIR OF SUBSTRATE HOLDERS, SUBSTRATE BONDING APPA...
- Publication number 20120214290
- Publication date Aug 23, 2012
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER SYSTEM, SUBSTRATE HOLDER, FASTENING MECHANISM, SUB...
- Publication number 20120205024
- Publication date Aug 16, 2012
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANAGING A HOLDER, APPARATUS FOR MANUFACTURING A LAYE...
- Publication number 20110288674
- Publication date Nov 24, 2011
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER, SUBSTRATE HOLDER UNIT, SUBSTRATE TRANSPORT APPARA...
- Publication number 20110007447
- Publication date Jan 13, 2011
- Hidehiro MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDING UNIT, SUBSTRATE BONDING APPARATUS, MULTI-LAYERED...
- Publication number 20100206454
- Publication date Aug 19, 2010
- Hidehiro MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPORT METHOD AND TRANSPORT APPARATUS
- Publication number 20100168908
- Publication date Jul 1, 2010
- Hidehiro MAEDA
- H01 - BASIC ELECTRIC ELEMENTS

Hidehiro Maeda

Person

Patents Grantslast 30 patents

Substrate bonding apparatus and substrate bonding method

Bonding method, bonding device, and holding member

Bonding method, bonding device, and holding member

Multi-layered substrate manufacturing method

Substrate holder, substrate holder unit, substrate transport appara...

Substrate holder system, substrate holder, fastening mechanism, sub...

Substrate bonding apparatus

Substrate holder, substrate holder unit, substrate transport appara...

Transport method and transport apparatus

Transport method and transport apparatus

Patents Applicationslast 30 patents

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

CONTROL DEVICE, CONTROL METHOD, AND PROGRAM

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

SUBSTRATE HOLDER AND SUBSTRATE BONDING APPARATUS

SUBSTRATE HOLDER, SUBSTRATE HOLDER UNIT, SUBSTRATE TRANSPORT APPARA...

Transport Method and Transport Apparatus

SUBSTRATE HOLDING UNIT, SUBSTRATE BONDING APPARATUS, MULTI-LAYERED...

Transport Method and Transport Apparatus

SUBSTRATE HOLDER, PAIR OF SUBSTRATE HOLDERS, SUBSTRATE BONDING APPA...

SUBSTRATE HOLDER SYSTEM, SUBSTRATE HOLDER, FASTENING MECHANISM, SUB...

APPARATUS FOR MANAGING A HOLDER, APPARATUS FOR MANUFACTURING A LAYE...

SUBSTRATE HOLDER, SUBSTRATE HOLDER UNIT, SUBSTRATE TRANSPORT APPARA...

SUBSTRATE HOLDING UNIT, SUBSTRATE BONDING APPARATUS, MULTI-LAYERED...

TRANSPORT METHOD AND TRANSPORT APPARATUS