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Hidehiro Minamiue
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Kokubu, JP
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Patents Grants
last 30 patents
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Patent Grant
Multi-layered wiring board for slot coupling a transmission line to...
Patent number
6,870,438
Issue date
Mar 22, 2005
Kyocera Corporation
Naoyuki Shino
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High frequency package, wiring board, and high frequency module hav...
Patent number
6,642,808
Issue date
Nov 4, 2003
Kyocera Corporation
Shinichi Koriyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High frequency wiring board and its connecting structure
Patent number
6,501,352
Issue date
Dec 31, 2002
Kyocera Corporation
Shinichi Koriyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High-frequency module using slot coupling
Patent number
6,483,406
Issue date
Nov 19, 2002
Kyocera Corporation
Yoshinobu Sawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High-frequency module coupled via aperture in a ground plane
Patent number
6,356,173
Issue date
Mar 12, 2002
Kyocera Corporation
Koichi Nagata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Slot antenna
Patent number
6,188,368
Issue date
Feb 13, 2001
Shinichi Koriyama
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
High frequency package, wiring board, and high frequency module
Publication number
20020003298
Publication date
Jan 10, 2002
Shinichi Koriyama
H01 - BASIC ELECTRIC ELEMENTS