TREA

HIDEHIRO TAZAWA

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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding device
    • Patent number 10,361,166
    • Issue date Jul 23, 2019
    • Shinkawa Ltd.
    • Osamu Kakutani
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING DEVICE
    • Publication number 20170053889
    • Publication date Feb 23, 2017
    • SHINKAWA LTD.
    • OSAMU KAKUTANI
    • H01 - BASIC ELECTRIC ELEMENTS