Hidehisa Sakai

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling system
- Patent number 10,575,392
- Issue date Feb 25, 2020
- Fujitsu Limited
- Yoshiteru Ochi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Setting method and information processing apparatus
- Patent number 9,471,716
- Issue date Oct 18, 2016
- Fujitsu Limited
- Takamasa Shinde
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor apparatus, substrate design method, and substrate des...
- Patent number 8,816,510
- Issue date Aug 26, 2014
- Fujitsu Limited
- Noriyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Analyzing apparatus, analyzing method, and computer-readable record...
- Patent number 8,204,699
- Issue date Jun 19, 2012
- Fujitsu Limited
- Hidehisa Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Crack growth evaluation apparatus, crack growth evaluation method,...
- Patent number 8,190,378
- Issue date May 29, 2012
- Fujitsu Limited
- Hidehisa Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Crack growth evaluation apparatus, crack growth evaluation method,...
- Patent number 7,873,501
- Issue date Jan 18, 2011
- Fujitsu Limited
- Hidehisa Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Multi-scale analysis device
- Patent number 7,773,814
- Issue date Aug 10, 2010
- Fujitsu Limited
- Hidehisa Sakai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic package evaluation apparatus, electronic package optimiz...
- Patent number 7,725,866
- Issue date May 25, 2010
- Fujitsu Limited
- Yoko Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus for predicting reliability in electronic device package,...
- Patent number 7,467,076
- Issue date Dec 16, 2008
- Fujitsu Limited
- Hidehisa Sakai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for predicting board deformation, and computer...
- Patent number 7,139,678
- Issue date Nov 21, 2006
- Fujitsu Limited
- Yoko Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Press-fit pin fitting in a miniaturized through hole formed in a ci...
- Patent number 5,738,550
- Issue date Apr 14, 1998
- Fujitsu Limited
- Masahiko Sakuraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a connector using frangible contact parts
- Patent number 5,475,922
- Issue date Dec 19, 1995
- Fujitsu Ltd.
- Akira Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and method of assembling the same
- Patent number 5,354,209
- Issue date Oct 11, 1994
- Fujitsu Limited
- Akira Tamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COOLING SYSTEM
- Publication number 20190281690
- Publication date Sep 12, 2019
- Fujitsu Limited
- Yoshiteru OCHI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT EXCHANGER, INFORMATION PROCESSING DEVICE, AND FLAT TUBE MANUFA...
- Publication number 20180135920
- Publication date May 17, 2018
- Fujitsu Limited
- Yoshiteru OCHI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SETTING METHOD AND INFORMATION PROCESSING APPARATUS
- Publication number 20140142899
- Publication date May 22, 2014
- Fujitsu Limited
- Takamasa Shinde
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DECOUPLED PARALLEL MESHING IN COMPUTER AIDED DESIGN
- Publication number 20140039847
- Publication date Feb 6, 2014
- Serban GEORGESCU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANALYZING APPARATUS, ANALYZING METHOD, AND COMPUTER-READABLE RECORD...
- Publication number 20100204932
- Publication date Aug 12, 2010
- Fujitsu Limited
- Hidehisa Sakai
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR APPARATUS, SUBSTRATE DESIGN METHOD, AND SUBSTRATE DES...
- Publication number 20100078810
- Publication date Apr 1, 2010
- Fujitsu Limited
- Noriyuki Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CIRCUIT BOARD ASSEMBLY
- Publication number 20100053923
- Publication date Mar 4, 2010
- Fujitsu Limited
- Noriyuki Matsui
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Crack growth evaluation apparatus, crack growth evaluation method,...
- Publication number 20090187353
- Publication date Jul 23, 2009
- FUJITSU LIMITED
- Hidehisa Sakai
- G01 - MEASURING TESTING
Information Patent Application
Crack growth evaluation apparatus, crack growth evaluation method,...
- Publication number 20080172211
- Publication date Jul 17, 2008
- FUJITSU LIMITED
- Hidehisa Sakai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC PACKAGE EVALUATION APPARATUS, ELECTRONIC PACKAGE OPTIMIZ...
- Publication number 20080127011
- Publication date May 29, 2008
- FUJITSU LIMITED
- Yoko KOBAYASHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DESIGN SUPPORT APPARATUS, DESIGN SUPPORT METHOD, AND DESIGN SUPPORT...
- Publication number 20080004855
- Publication date Jan 3, 2008
- Hidehisa SAKAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Multi-scale analysis device
- Publication number 20070005310
- Publication date Jan 4, 2007
- FUJITSU LIMITED
- Hidehisa Sakai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Appararus for predicting reliability in electronic device package,...
- Publication number 20060294436
- Publication date Dec 28, 2006
- FUJITSU LIMITED
- Hidehisa Sakai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for predicting board deformation, and computer...
- Publication number 20060036401
- Publication date Feb 16, 2006
- FUJITSU LIMITED
- Yoko Kobayashi
- G06 - COMPUTING CALCULATING COUNTING

Hidehisa Sakai

Person

Patents Grantslast 30 patents

Cooling system

Setting method and information processing apparatus

Semiconductor apparatus, substrate design method, and substrate des...

Analyzing apparatus, analyzing method, and computer-readable record...

Crack growth evaluation apparatus, crack growth evaluation method,...

Crack growth evaluation apparatus, crack growth evaluation method,...

Multi-scale analysis device

Electronic package evaluation apparatus, electronic package optimiz...

Apparatus for predicting reliability in electronic device package,...

Method and apparatus for predicting board deformation, and computer...

Press-fit pin fitting in a miniaturized through hole formed in a ci...

Method of assembling a connector using frangible contact parts

Connector and method of assembling the same

Patents Applicationslast 30 patents

COOLING SYSTEM

HEAT EXCHANGER, INFORMATION PROCESSING DEVICE, AND FLAT TUBE MANUFA...

SETTING METHOD AND INFORMATION PROCESSING APPARATUS

DECOUPLED PARALLEL MESHING IN COMPUTER AIDED DESIGN

ANALYZING APPARATUS, ANALYZING METHOD, AND COMPUTER-READABLE RECORD...

SEMICONDUCTOR APPARATUS, SUBSTRATE DESIGN METHOD, AND SUBSTRATE DES...

SEMICONDUCTOR DEVICE AND CIRCUIT BOARD ASSEMBLY

Crack growth evaluation apparatus, crack growth evaluation method,...

Crack growth evaluation apparatus, crack growth evaluation method,...

ELECTRONIC PACKAGE EVALUATION APPARATUS, ELECTRONIC PACKAGE OPTIMIZ...

DESIGN SUPPORT APPARATUS, DESIGN SUPPORT METHOD, AND DESIGN SUPPORT...

Multi-scale analysis device

Appararus for predicting reliability in electronic device package,...

Method and apparatus for predicting board deformation, and computer...