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Hidehisa Yamazaki
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Okayama-ken, JP
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Patents Grants
last 30 patents
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Patent Grant
Method of forming an interlayer connection structure
Patent number
6,243,946
Issue date
Jun 12, 2001
Yamaichi Electronics Co., Ltd.
Etsuji Suzuki
B30 - PRESSES
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Patent Grant
IC package having a single wiring sheet with a lead pattern dispose...
Patent number
5,973,395
Issue date
Oct 26, 1999
Yamaichi Electronics Co., Ltd.
Etsuji Suzuki
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Circuit board
Patent number
5,950,306
Issue date
Sep 14, 1999
Yamaichi Electronics Co., Ltd.
Etsuji Suzuki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR