Hideji Aoki

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Machida, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having soldered bond between base and cap thereof
- Patent number 4,626,960
- Issue date Dec 2, 1986
- Fujitsu Limited
- Toshio Hamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for electronic device and method for producing same
- Patent number 4,590,672
- Issue date May 27, 1986
- Fujitsu Limited
- Shokichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly reliable hermetically sealed package for a semiconductor device
- Patent number 4,558,346
- Issue date Dec 10, 1985
- Fujitsu Limited
- Susumu Kida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for enclosing semiconductor elements
- Patent number 4,458,291
- Issue date Jul 3, 1984
- Fujitsu Limited
- Mamoru Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS