Hideji Aoki

Person

Fukuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mold for resin-sealing of semiconductor devices
- Patent number 6,530,764
- Issue date Mar 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiyuki Mishima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 6,363,976
- Issue date Apr 2, 2002
- Mitsubishi Electric Engineering Co., Ltd.
- Hideji Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press machine and method of manufacturing pressed products
- Patent number 6,337,042
- Issue date Jan 8, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Suekazu Nakashima
- B30 - PRESSES
Information Patent Grant
Semiconductor device manufacturing method, press die and guide rail...
- Patent number 6,242,287
- Issue date Jun 5, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Hideji Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method of fabricating semiconductor devices
- Patent number 5,842,257
- Issue date Dec 1, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Takahiro Tashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for carrying and locating sheet frame
- Patent number 5,636,127
- Issue date Jun 3, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Hideji Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Press control method and press apparatus
- Patent number 5,587,633
- Issue date Dec 24, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Hideji Aoki
- B30 - PRESSES
Information Patent Grant
Method and apparatus for carrying and locating sheet frame
- Patent number 5,520,276
- Issue date May 28, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Hideji Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for feeding thin-web frame
- Patent number 5,177,992
- Issue date Jan 12, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Hideji Aoki
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Patents Applicationslast 30 patents

Information Patent Application
Mold for resin-sealing of semiconductor devices
- Publication number 20020012716
- Publication date Jan 31, 2002
- Yoshiyuki Mishima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Hideji Aoki

Person

Patents Grantslast 30 patents

Mold for resin-sealing of semiconductor devices

Semiconductor manufacturing apparatus and method of manufacturing s...

Press machine and method of manufacturing pressed products

Semiconductor device manufacturing method, press die and guide rail...

Apparatus for and method of fabricating semiconductor devices

Method and apparatus for carrying and locating sheet frame

Press control method and press apparatus

Method and apparatus for carrying and locating sheet frame

Device for feeding thin-web frame

Patents Applicationslast 30 patents

Mold for resin-sealing of semiconductor devices