Hideji Kuwajima

Person

Chikusei-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Mixed conductive powder and use thereof
- Patent number 8,029,701
- Issue date Oct 4, 2011
- Hitachi Chemical Co., Ltd.
- Hideji Kuwajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mixed conductive power and use thereof
- Patent number 7,790,063
- Issue date Sep 7, 2010
- Hitachi Chemical Company, Ltd.
- Hideji Kuwajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste
- Patent number 7,718,090
- Issue date May 18, 2010
- Hitachi Chemical Co., Ltd.
- Hideji Kuwajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive powder and method for preparing the same
- Patent number 7,294,289
- Issue date Nov 13, 2007
- Hitachi Chemical Co., Ltd.
- Hideji Kuwajima
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Conductive powder and method for preparing the same
- Patent number 7,083,859
- Issue date Aug 1, 2006
- Hitachi Chemical Co., Ltd.
- Hideji Kuwajima
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Through-hole wiring board
- Patent number 6,515,237
- Issue date Feb 4, 2003
- Hitachi Chemical Company, Ltd.
- Junichi Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric circuit device having circuit conductors using an electroc...
- Patent number 6,042,933
- Issue date Mar 28, 2000
- Hitachi Chemical Company, Ltd.
- Keizo Hirai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Composite electroconductive powder, electroconductive paste, proces...
- Patent number 5,951,918
- Issue date Sep 14, 1999
- Hitachi Chemical Company, Ltd.
- Hideji Kuwajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive paste
- Patent number 5,840,432
- Issue date Nov 24, 1998
- Hitachi Chemical Company, Ltd.
- Keizo Hirai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bi-Pb-Sr-Mg-Ba-Ca-Cu-O oxide superconductors and production thereof
- Patent number 5,194,421
- Issue date Mar 16, 1993
- Hitachi Chemical Company
- Shuichiro Shimoda
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Superconducting thick film circuit board, production thereof, thick...
- Patent number 5,147,851
- Issue date Sep 15, 1992
- Hitachi Chemical Company Ltd.
- Shozo Yamana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted mica materials, reconstituted mica prepreg materials,...
- Patent number 4,576,856
- Issue date Mar 18, 1986
- Hitachi Chemical Company, Ltd.
- Hideji Kuwajima
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Reconstituted mica materials, reconstituted mica prepreg materials,...
- Patent number 4,491,618
- Issue date Jan 1, 1985
- Hitachi Chemical Company, Ltd.
- Hideji Kuwajima
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for disintegrating mica flakes and apparatus used therefor
- Patent number 4,165,839
- Issue date Aug 28, 1979
- Hitachi Chemical Company, Ltd.
- Hideji Kuwajima
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
MIXED CONDUCTIVE POWDER AND USE THEREOF
- Publication number 20100323198
- Publication date Dec 23, 2010
- Hideji Kuwajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mixed conductive power and use thereof
- Publication number 20070164260
- Publication date Jul 19, 2007
- Hideji Kuwajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE POWDER AND METHOD FOR PREPARING THE SAME
- Publication number 20060219985
- Publication date Oct 5, 2006
- Hitachi Chemical Co., Ltd.
- Hideji Kuwajima
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Conductive paste
- Publication number 20060145125
- Publication date Jul 6, 2006
- Hideji Kuwajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive powder and method for preparing the same
- Publication number 20050034560
- Publication date Feb 17, 2005
- Hitachi Chemical Co., Ltd.
- Hideji Kuwajima
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Through-hole wiring board
- Publication number 20020062990
- Publication date May 30, 2002
- Junichi Kikuchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Hideji Kuwajima

Person

Patents Grantslast 30 patents

Mixed conductive powder and use thereof

Mixed conductive power and use thereof

Conductive paste

Conductive powder and method for preparing the same

Conductive powder and method for preparing the same

Through-hole wiring board

Electric circuit device having circuit conductors using an electroc...

Composite electroconductive powder, electroconductive paste, proces...

Electroconductive paste

Bi-Pb-Sr-Mg-Ba-Ca-Cu-O oxide superconductors and production thereof

Superconducting thick film circuit board, production thereof, thick...

Reconstituted mica materials, reconstituted mica prepreg materials,...

Reconstituted mica materials, reconstituted mica prepreg materials,...

Method for disintegrating mica flakes and apparatus used therefor

Patents Applicationslast 30 patents

MIXED CONDUCTIVE POWDER AND USE THEREOF

Mixed conductive power and use thereof

CONDUCTIVE POWDER AND METHOD FOR PREPARING THE SAME

Conductive paste

Conductive powder and method for preparing the same

Through-hole wiring board