Hidekazu IWASAKI

Person

Gunma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Contact probe and inspection socket provided with contact probe
- Patent number 11,394,148
- Issue date Jul 19, 2022
- Unitechno Inc.
- Hidekazu Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,551,432
- Issue date Feb 4, 2020
- Renesas Electronics Corporation
- Toshitsugu Ishii
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 10,109,568
- Issue date Oct 23, 2018
- Renesas Electronics Corporation
- Jun Matsuhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 9,945,903
- Issue date Apr 17, 2018
- Renesas Electronics Corporation
- Toshitsugu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and inspecting an el...
- Patent number 9,905,482
- Issue date Feb 27, 2018
- Renesas Electronics Corporation
- Toshitsugu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and inspecting an el...
- Patent number 9,761,501
- Issue date Sep 12, 2017
- Renesas Electronics Corporation
- Toshitsugu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,515,000
- Issue date Dec 6, 2016
- Renesas Electronics Corporation
- Toshitsugu Ishii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT PROBE AND INSPECTION SOCKET PROVIDED WITH CONTACT PROBE
- Publication number 20210336365
- Publication date Oct 28, 2021
- UNITECHNO INC.
- Hidekazu Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180340976
- Publication date Nov 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Toshitsugu ISHII
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20180102310
- Publication date Apr 12, 2018
- RENESAS ELECTRONICS CORPORATION
- Jun MATSUHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170338159
- Publication date Nov 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Toshitsugu Ishii
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170025318
- Publication date Jan 26, 2017
- RENESAS ELECTRONICS CORPORATION
- Toshitsugu ISHII
- G01 - MEASURING TESTING
Information Patent Application
Method for Manufacturing Semiconductor Device
- Publication number 20160141215
- Publication date May 19, 2016
- RENESAS ELECTRONICS CORPORATION
- Toshitsugu ISHII
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160064291
- Publication date Mar 3, 2016
- RENESAS ELECTRONICS CORPORATION
- Toshitsugu Ishii
- H01 - BASIC ELECTRIC ELEMENTS

Hidekazu IWASAKI

Person

Patents Grantslast 30 patents

Contact probe and inspection socket provided with contact probe

Method of manufacturing semiconductor device

Semiconductor device manufacturing method and semiconductor device

Semiconductor device manufacturing method

Method of manufacturing a semiconductor device and inspecting an el...

Method of manufacturing a semiconductor device and inspecting an el...

Method for manufacturing semiconductor device

Patents Applicationslast 30 patents

CONTACT PROBE AND INSPECTION SOCKET PROVIDED WITH CONTACT PROBE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Method for Manufacturing Semiconductor Device

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE